Overview
A complete RF Modem companion chip for adding Bluetooth Low Energy v5.x (2.4GHz), Sub-1GHz (150-960MHz), 802.15.4(Zigbee),capability to any embedded CPU SoC via a standard SPI interface.
Integrated BLE Link Layer and FSK, GFSK, OOK Modem enables data rates of 2Mbps for Bluetooth and 50Kbps for Sub-1GHz. Connection range from ~100 meters with Bluetooth to ~50Km over Sub-1GHz ISM band.
Standard SPI interface plus chip select & packet sync pins for interfacing a MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required.
Low cost & simple upgrade to any embedded MCU system.
Learn more about Bluetooth IP core
The adoption of the Bluetooth low energy (Bluetooth LE) specifications v4.0/v4.2 standards is being driven by adoption in several markets such as the Health and Fitness devices, Beacons, Asset tracking, Home automation, PC Peripherals etc. Bluetooth low energy 5, together with the Bluetooth LE Mesh specifications are set to make Bluetooth the ‘Connectivity of Choice’ in IoT markets such as Connected Home, Commercial Lighting and Industrial Wireless Sensor Network markets.
Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.
Franz Dugand, Ceva
Navot Goren, Ceva
Laura Moore
Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.
