Our mass production-proven IPTD2D-A D2D Interconnect IP Solutions offer industry- power efficiency, performance, and low latency,…
- Custom
Our mass production-proven IPTD2D-A D2D Interconnect IP Solutions offer industry- power efficiency, performance, and low latency,…
Accelerated confidence in simulation-based verification of RTL designs with Universal Chiplet Interconnect Express (UCIe) interfa…
TSMC CLN5FF GUCIe LP Die-to-Die PHY
IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.
Best-in-Class UCIe Verification IP for your IP, SoC, and System-Level Design Testing The Cadence Verification IP (VIP) for Univer…
The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.
The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
The Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications.
BlueLynx PHY IP is one side of a die-to-die parallel interface delivered as a single GDS Hard IP and a single RTL Soft IP.
D2D Controller addon for D2D SR112G PHY with CXS interface
The Die-to-Die Controller IP, optimized for latency, bandwidth, power, and area, enables efficient inter-die connectivity in serv…