D2D interconnect IP Listing

Our mass production-proven IPTD2D-A D2D Interconnect IP Solutions offer industry- power efficiency, performance, and low latency,…

• Custom

Accelerated confidence in simulation-based verification of RTL designs with Universal Chiplet Interconnect Express (UCIe) interfa…

• UCIe

IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.

• TSMC
• 5nm
• N5FF

Best-in-Class UCIe Verification IP for your IP, SoC, and System-Level Design Testing The Cadence Verification IP (VIP) for Univer…

• UCIe

The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.

• TSMC
• 16nm
• FFC

The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.

• Samsung
• 8nm

The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.

• UCIe

The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.

• UCIe

The Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications.

• GlobalFoundries
• 22nm
• FDX

BlueLynx PHY IP is one side of a die-to-die parallel interface delivered as a single GDS Hard IP and a single RTL Soft IP.

• Custom

The Die-to-Die Controller IP, optimized for latency, bandwidth, power, and area, enables efficient inter-die connectivity in serv…

• Custom