LogicFlash® Embedded MTP in TSMC 180nm~130nm
LogicFlash® MTP?????CMOS???????????????,????????,??????????,?????1?????,??IP??,???1KB~64KB???????,??????2????????
- TSMC
- 180nm
- BCDG2
- Available on request
Semiconductor IP cores (Intellectual Property cores) are reusable design blocks used in SoC and ASIC development to accelerate time-to-market and reduce design complexity.
These IP cores span a broad range of technologies, including Analog & Mixed Signal, Compute Acceleration, Graphics & Vision, Interface Connectivity , Memory Interfaces, Security, Wireless, System Peripheral, Embedded Memories, and Foundation Libraries. The catalog covers everything from analog front-ends, data converters, processors, DSPs, AI accelerators, and imaging solutions to high-speed connectivity, memory controllers and PHYs, cryptographic engines, embedded memory macros, standard cell libraries, and wireless communication IP.
This catalog allows you to explore and compare IP cores from leading vendors, based on performance, power, process node compatibility, and application domain.
Whether you are designing for automotive, wireless communication, consumer electronics, or data centers, you can find the right IP solutions for your system requirements.
LogicFlash® Embedded MTP in TSMC 180nm~130nm
LogicFlash® MTP?????CMOS???????????????,????????,??????????,?????1?????,??IP??,???1KB~64KB???????,??????2????????
LogicFlash® Embedded MTP in Silterra 180nm~110nm
LogicFlash® MTP?????CMOS???????????????,????????,??????????,?????1?????,??IP??,???1KB~64KB???????,??????2????????
LogicFlash® Embedded MTP in UMC 180nm~110nm
LogicFlash® MTP?????CMOS???????????????,????????,??????????,?????1?????,??IP??,???1KB~64KB???????,??????2????????
LogicFlash® Embedded MTP in HHGrace 180nm~55nm
LogicFlash® MTP?????CMOS???????????????,????????,??????????,?????1?????,??IP??,???1KB~64KB???????,??????2????????
LogicFlash® Embedded MTP in GlobalFoundries 180nm~110nm
LogicFlash® MTP是一种基于CMOS工艺的嵌入式非挥发性存储器技术,基于逻辑工艺实现,无需增加额外光罩层次,或通过增加1层额外光罩,缩减IP面积,适合于1KB~64KB的中等容量应用,同时提供高达2万次的擦写次数。
LogicFlash® Embedded MTP in Tower 180nm
LogicFlash® MTP?????CMOS???????????????,????????,??????????,?????1?????,??IP??,???1KB~64KB???????,??????2????????
LogicFlash® Embedded MTP in SMIC 180nm~55nm
LogicFlash® MTP?????CMOS???????????????,????????,??????????,?????1?????,??IP??,???1KB~64KB???????,??????2????????
LogicEE® Embedded EEPROM in SMIC 180nm~55nm
LogicEE® EEPROM IP?????EEPROM?IP????,?????????,?????????????????2K??(Byte)????,???????,??????10???????????
Library of LVDS Ios cells in TSMC 180nm~22nm
This IP is a total solution for LVDS applications, including LVDS transmitter I/O, receiver I/O, common block and power/ground I/…
Library of LVDS Ios cells in HHGrace 130nm~55nm
This IP is a total solution for LVDS applications, including LVDS transmitter I/O, receiver I/O, common block and power/ground I/…
Library of LVDS Ios cells in SMIC 130nm~28nm
This IP is a total solution for LVDS applications, including LVDS transmitter I/O, receiver I/O, common block and power/ground I/…
The ACTT family of interface IP for MIPI protocols is the way with mobile-optimized low power and high performance.
BLE & BT 5.2 dual mode RFIP in UMC 55nm~22nm
ACTT’s Bluetooth 5.2 Radio IP available in 55nm~22nm logic process node.
BLE & BT 5.2 dual mode RFIP in SMIC 55nm~28nm
ACTT’s Bluetooth 5.2 Radio IP available in 55nm~22nm logic process node.
BLE & BT 5.2 dual mode RFIP in TSMC 55nm~22nm
ACTT’s Bluetooth 5.2 Radio IP available in 55nm~22nm logic process node.
ACTT’s Bluetooth Low Energy 5.2 Radio IP available from 55nm~22nm logic process node.
ACTT’s Bluetooth Low Energy 5.2 Radio IP available from 55nm~22nm logic process node.
ACTT’s Bluetooth Low Energy 5.2 Radio IP available from 55nm~22nm logic process node.
65nm LP 2.5V/1.2V 11bit 2.5Mhz R2R DAC [1ch]
The IGADACR03A is a general-purpose digital-to-analog converter with 11-bit resolution.
65nm LP 2.5V/1.2V 12bit 80MHz Current Steering DAC [2ch]
The IGADACR02A is a general-purpose two-channel digital-to-analog converter with 12-bit resolution.