High-performance and low-power 3D graphics IP core
High-performance and low-power 3D graphics IP core for embedded devices.
Overview
High-performance and low-power 3D graphics IP core for embedded devices.
It has high computing performance required for advanced visual computing and high-performance graphics performance required for virtual reality (VR) and augmented reality (AR) applications.
Key features
- M3000 series are 3D GPU IP cores that support OpenGL® ES3.0 adopting the DMP 3D graphics architecture “Musashi” and achieve the industry’s highest-level PPA (Power / Performance / Area).
- With a configurable shader cluster architecture, the optimal GPU IP core configuration is provided according to customer’s requirements for performance and size.
Benefits
- API: OpenGL® ES 3.0 / 2.0
- Texture Format: OpenGL® ES supported format, ETC2, ASTC, YUV
- Maximum Resolution: 4k x 2k
- Memory BUS I/F: AXI 3 / 4
- Configuration Register I/F: AXI 3 / 4、APB
Applications
Video
Files
Note: some files may require an NDA depending on provider policy.
Specifications
Identity
Provider
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Frequently asked questions about GPU IP cores
What is High-performance and low-power 3D graphics IP core?
High-performance and low-power 3D graphics IP core is a GPU IP core from Digital Media Professionals Inc. (DMP Inc.) listed on Semi IP Hub.
How should engineers evaluate this GPU?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this GPU IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.