Vendor: Global UniChip Corp. (GUC) Category: FIFO / CAM

TSMC CLN16FFC Ternary Content Addressable Memory

IGMTLSLV02A is a synchronous LVT periphery high-density ternary content addressable memory (TCAM).

TSMC 16nm FFC Silicon Proven View all specifications

Overview

IGMTLSLV02A is a synchronous LVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16 nm 0.8 V/1.8 V CMOS LOGIC FinFET Compact Process. Different combinations of words, bits can be used to generate the most desirable configurations.
Given the desired size and timing constraints, the IGMTLSV02A compiler is capable of providing suitable synchronous TCAM layout instances within minutes. It is capable of automatically generating the data sheets, Verilog behavioral simulation models, Place & Route (P & R) models, and test patterns for use in ASIC designs. The duty cycle length can be neglected as long as the setup/hold times and minimum high/low pulse widths are satisfied. This allows a more flexible clock falling edge during each operation.

Key features

  • Ternary Content Addressable Memory (TCAM) operates within a voltage range from 0.72 V to 0.88 V and a junction temperature range from -40 oC to 125 oC. The available supported macro size is configured from 128 bits to 80K bits.
  • Pins and metal layers
  • 5 metal layers used and top metal is Mxe_v
  • Power mesh with M5 pins support
  • General feature
  • TSMC 16T 0.345 um2 NOR TCAM bit cell
  • Full-customized design to optimize for performance, power and area
  • Two arrays, Data and Mask arrays, used to encode 0, 1 or X
  • Memory control pins for read/write and compare
  • Global mask input for bit-write and masked-key search capability
  • Dynamic compare power saving by appropriately configuring bank enable pins
  • Valid bit per entry
  • MATCHLINE outputs
  • Supports BIST code
  • Frequently used EDA model support
  • CPODE layer (206;32) used in layout design

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 16nm FFC Silicon Proven

Specifications

Identity

Part Number
IGMTLSV02A
Vendor
Global UniChip Corp. (GUC)

Provider

Global UniChip Corp. (GUC)
HQ: Taiwan
Global Unichip Corp. (GUC), a dedicated full service SoC (System On Chip) Design Foundry based in Taiwan, was founded in 1998. GUC provides total solutions from silicon-proven IPs to complex time-to-market SoC turnkey services. GUC is committed to providing the most advanced and the best price-performance silicon solutions through close partnership with TSMC, GUC major shareholder, and other key packaging and testing power houses. With state of the art EDA tools, advanced methodologies, and experienced technical team, GUC ensures the highest quality and lowest risks to achieve first silicon success. GUC has established a global customer base throughout Greater China, Japan, Korea, North America, and Europe. Its track-record in complex SoC designs has brought benefits to customers in time to revenue at the lowest risk.

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Frequently asked questions about FIFO / CAM IP cores

What is TSMC CLN16FFC Ternary Content Addressable Memory?

TSMC CLN16FFC Ternary Content Addressable Memory is a FIFO / CAM IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.

How should engineers evaluate this FIFO / CAM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this FIFO / CAM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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