Overview
IGMTLSLV02A is a synchronous LVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16 nm 0.8 V/1.8 V CMOS LOGIC FinFET Compact Process. Different combinations of words, bits can be used to generate the most desirable configurations.
Given the desired size and timing constraints, the IGMTLSV02A compiler is capable of providing suitable synchronous TCAM layout instances within minutes. It is capable of automatically generating the data sheets, Verilog behavioral simulation models, Place & Route (P & R) models, and test patterns for use in ASIC designs. The duty cycle length can be neglected as long as the setup/hold times and minimum high/low pulse widths are satisfied. This allows a more flexible clock falling edge during each operation.
Learn more about FIFO / CAM IP core
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When implementing new embedded applications, industrial companies are facing new challenges: these applications are very complex to program (between 5 and 10 million lines of code are common) and require handling of several possibly heterogeneous models and languages. Integration choices are wide-ranging, from functions hard-coded in hardware IP to embedded software for multi-core clusters. Additionally integration must take into account at the same time several kinds of constraints: processing power, memories, power budget limitation, etc.