Vendor: Low Power Futures Category: Bluetooth

IP Platform for Bluetooth 5.2

The LP1-200 IP Platform is built around the Bluetooth 5 connectivity standard.

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Overview

The LP1-200 IP Platform is built around the Bluetooth 5 connectivity standard. It consists of a Bluetooth 5.2 Low Energy and BR-EDR controllers, an optional low power audio IP and a low power neural net processor IP. The LP1-200 IP Platform is designed to bring secure wireless connectivity and low-power sensor signal conditioning to various low-power multimedia applications, including hearing aids, speakers, headphones and consumer electronics.
The LP1-200 IP Platform is fully integrated for better portability to different embedded processors, including ARM, RISCV and ANDES. It can be smoothly integrated into an SoC or used as the main socle of a standalone SoC.

Key features

  • LE 5.2 CONTROLLER :
    • GFSK modem @ 2.4GHz (1M Uncoded PHY, 2M Uncoded PHY, 1M Coded PHY)
    • Bitstream Processing (FEC convolutional encoder/decoder, Data whitening, CRC, AES CCM)
    • Constant Tone Extension (IQ Sampling)
    • Channel Selection Algorithm for connection events and sub events
    • Broadcast Isochronous Stream
    • Connection Supervision
    • Link Layer Firmware and HCI
  • BR-EDR CONTROLLER :
    • Basic rate
    • Enhanced Data rate
    • Bitstream Processing (FEC 1/3 and 2/3 coding rates, FEC convolutional, Data whitening, CRC, HEC, Access Code Generation, AES CCM))
    • Connection Supervision
    • ESCO support
    • Link Manager Firmware and HCI
  • AUDIO :
    • L3C Codec (Audio Stream Encoding, Audio Stream decoding)
    • Configurable noise cancelling filter
  • NEURAL NETWORK PROCESSOR :
    • Fully programmable
    • Int16
    • Fixed Point
    • FP16
    • Built-in prescaling and denormalization
  • SECURITY ACCELERATOR :
    • Protocol Supported : ECDHE, ECDSA
    • Acceleration units : ECC-233, SHA256, AES 128
    • TRNG
  • AMBA standard interface : AXI/AHB/APB

Benefits

  • Power and area-optimized
  • Fully integrated for better portability to different embedded processors, including ARM and RISCV
  • Built for smooth integration into an SoC or used as the main foundation of a standalone SoC
  • Support for highly-differentiating products at a lower cost and time-to-market
  • Complete UVM Verification environment
  • End-to-end FPGA Validation Platform validated with qualified certification tools

Applications

  • Hearing Aids
  • Wireless Speakers
  • Consumer Electronics
  • In-car infotainment

What’s Included?

  • Delivered as Soft or Hard IP
  • Link Layer, Link Controller Firmware and HCI
  • FPGA Validation Platform
  • UVM Test Bench
  • Technical Specifications
  • Integration Manual

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Specifications

Identity

Part Number
LP1-200
Vendor
Low Power Futures

Provider

Low Power Futures
HQ: Canada
Low Power Futures is an industry leading low-power and ultra-low-power hardware and firmware IP for IoT. We enable the “Internet of Things” by providing innovative, power-efficient, highly integrated, secure and configurable IPs designed for low-power IoT systems. With LPF IP leverage reconfigurable technology for custom and optimize IoT chip solutions and products.
Contact Low Power Futures

Learn more about Bluetooth IP core

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Frequently asked questions about Bluetooth IP cores

What is IP Platform for Bluetooth 5.2?

IP Platform for Bluetooth 5.2 is a Bluetooth IP core from Low Power Futures listed on Semi IP Hub.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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