Vendor: SiliconBlu Ltd. Category: Bluetooth

Bluetooth Low Energy Subsystem IP

The BLE v6.0 Subsystem IP consists of an integrated Controller and Modem paired to a proprietary RF on T22 ULL.

Overview

The BLE v6.0 Subsystem IP consists of an integrated Controller and Modem paired to a  proprietary RF on T22 ULL. It is ideally suited to ASIC developers or fabless semiconductor companies who want to add BLE functionality without the hassle of dealing with multiple IP vendors or design groups.​

BLE sensitivity of -101dBm is achievable at 1MBps, whilst transmit total power consumption lower than 9mW is achieved at +0dBm. The Scalable RFIP operates from voltages as low as 1.05V, with higher voltages needed to achieve transmit powers above +6dBm

BLE SUBSYSTEM ARCHITECTURE

Upper Controller Library

  • Runs as a task on the Host CPU
  • Portable C library, processor independent
  • Driven by Interrupts from the Lower Controller

Lower Controller Library

  • Runs on supplied CPU, tightly coupled to Baseband
  • Embedded firmware and hardware drivers
  • Data transfer using DMA – directly into system memory
  • Power efficient, only on when active
  • Patchable ROM, saves power but allows rapid feature development

Simulation Development Environment

  • Allows pre-silicon feature development
  • Firmware can be run on SiliconBlu’s simulation environment to simulate any number of devices
  • Verilated RTL can also be included in simulator

Key features

  • High performance, ultra efficient BLE radio
  • Supports BLE 5.4, Isochronous Channels, PAwR, Direction Finding, BLE Mesh
  • Supports BLE 6.0 Channel Sounding
  • Processor-agnostic Controller stack
  • Optimised for Zephyr Host Stack
  • Controller stack is architected for ease of customisation
  • Proprietary Simulation Environment to accelerate feature development and scenario testing
  • Supports 802.15.42, Matter, Thread, Zigbee
  • Single-ended RF pin to reduce eBOM
  • Integrated PA with up to +10dBm TX power
  • BLE Receiver sensitivity of -101dBm at 1Mbit/s, and -107dBm at 125kbit/s
  • 802.15.4 Receiver sensitivity of -105dBm
  • TX current 2.85mA3 at +0dBm TX power (from 3.0V)
    • TX current of 5.0mA3 at +6dBm TX power (3.0V)
  • RX current of 2.1mA3 (from 3.0V) at -101dBm
    • Rx current of 0.9mA3 (3.0V) at -93dBm

Block Diagram

Benefits

  • Ultra-low active and deep-sleep power consumption to enable multi-year battery life
  • High TX power and industry-leading RX sensitivity for reliable, longer-range BLE communications
  • Highly optimised Controller and Modem to minimise the gate count and associated die area

Applications

  • Wireless Sensing Networks
  • Connected Home, Smart Lighting and TV RCU
  • Asset Tags, Beacons and ‘Find my’ applications
  • Digital Key Solutions
  • Portable Medical and Fitness Devices
  • Building Automation and Security
  • Electronic Shelf Labelling
  • Tyre Pressure Monitoring Systems

Files

Note: some files may require an NDA depending on provider policy.

Specifications

Identity

Part Number
SB1001-00
Vendor
SiliconBlu Ltd.

Provider

SiliconBlu Ltd.
HQ: Ireland
SiliconBlu is based in Europe and has developed an ultra-low power BLE6.0 subsystem with class-leading Controller, Modem and RF Performance per μW. The team has strong industry experience with previous careers in Imagination Technologies, Nordic Semi and Dialog Semiconductors. The Controller and Modem are available for licensing now, with the RF on T22 ULL available from late 2025.

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Frequently asked questions about Bluetooth IP cores

What is Bluetooth Low Energy Subsystem IP?

Bluetooth Low Energy Subsystem IP is a Bluetooth IP core from SiliconBlu Ltd. listed on Semi IP Hub.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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