Vendor: Ceva, Inc. Category: Bluetooth

Bluetooth Connectivity Platform

The Ceva-Waves Bluetooth platform comprises a comprehensive set of hardware IP, software modules, and radios from Ceva and third-…

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Overview

The Ceva-Waves Bluetooth platform comprises a comprehensive set of hardware IP, software modules, and radios from Ceva and third-party partners addressing a broad choice of processes and nodes, to implement highly efficient Bluetooth connectivity in SoCs. The latest Bluetooth standards, both Bluetooth LE and dual-mode versions are supported, and an available add-in extends support to IEEE 802.15.4. Embedded into one of the Ceva-Waves Links multi-protocol wireless platforms, the Ceva-Waves Bluetooth IPs can efficiently co-exist with the Ceva-Waves Wi-Fi IP and/or Ceva-Waves UWB IP.

The Solution

The Ceva-Waves Bluetooth platform includes field-proven hardware IP for baseband controller, modem, and 2.4 GHz RF transceiver functions, and allows use of many third-party radio IPs as well. The platform includes optimized baseband controller hardware and software, and above the Host Controller Interface (HCI) a host-agnostic software protocol stack supporting all major Bluetooth profiles. The built-in 802.15.4 add-on suite shares the same Bluetooth radio, and includes IEEE 802.15.4 MAC & modem hardware IP and software, and is compatible with Zigbee, Thread and Matter host protocol stacks.

The Ceva-Waves Bluetooth platform is also available as part of the Ceva-Waves Links family of multi-protocol turnkey platforms, including with optimized Wi-Fi & Bluetooth co-existence interface and packet traffic arbiter.

The Ceva-Waves Bluetooth platforms also comprises a state-of-the-art radio in TSMC 12nm FFC+ supporting all the latest Bluetooth 6.0 dual mode features, along with next gen Bluetooth High Data Throughput and IEEE 802.15.4. Its innovative architecture provides best in class performance in term of power consumption, die size, sensitivity and output power.

Key features

  • Full Bluetooth compatibility – supporting all features up to version 6.0 of the Bluetooth Core Specifications for both Bluetooth LE and dual mode, including Long Range, Mesh, AoA/AoD Direction Finding, both Classic Audio and LE Audio with Auracast, Periodic Advertising with Response (PAwR), and Channel Sounding
  • Compatible with Ceva’s radio and many third-party radio IP blocks
  • Hardware modem supporting all modulations and data rates: GFSK BR1M, LE1M/LE2M/LR125K/LR500K, π/4-DQPSK 2M, 8-DPSK 3M, O-QPSK 250K
  • Hardware baseband controller IP with minimal interrupts significantly off-loads the CPU for for lowest MIPS and power consumption
  • Software stack supports all modes and packet types, and a comprehensive set of profiles, in either HCI-split or fully hosted configurations.
  • State of the art radio in TSMC 12nm FFC+ supporting Bluetooth dual mode including next gen High Data Throughput, and IEEE 802.15.4.

Block Diagram

Ceva-Waves Bluetooth block diagram

Benefits

  • The Ceva-Waves Bluetooth platforms provide a fast, low-risk path for integrating low power and robust Bluetooth connectivity into an SoC.
  • The suite of optimized, integrated hardware IP and software has been deployed and Bluetooth SIG qualified in many customer chips. The feature-rich software stack supports a comprehensive et of profiles, including an IEEE 802.15.4 connectivity addon support.
  • Working with a wide variety of Ceva and third-party embedded-processor cores and radios, the unique blend of hardware assistance and optimized software minimizes interrupt load, eases real-time constraints on software, and consequently reduces performance demands on the CPU, allowing more flexibility in CPU selection and reducing power consumption.
  • A Wi-Fi coexistence interface and the ability to share a radio with Wi-Fi as in the Ceva-Waves Links100 platform guarantee power- and area-efficient integration of Bluetooth and 802.15.4 with Ceva-Waves Wi-Fi on an SoC.

Applications

  • Consumer IoT
  • Automotive
  • Industrial 
  • Mobile
  • PC 

Files

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Specifications

Identity

Part Number
Ceva-Waves Bluetooth
Vendor
Ceva, Inc.

Provider

Ceva, Inc.
HQ: USA
The Smart Edge runs on Ceva! Ceva is the leader in innovative silicon and software IP solutions that enable smart edge products to connect, sense, and infer data more reliably and efficiently. At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years. With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 17 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva. We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically. Ceva is a trusted partner to over 400 of the leading semiconductor and OEM companies including Actions, Artosyn, ASR, Atmosic, Autotalks, Beken, Bestechnic, Brite, Broadcom, Celeno, Ceragon, Cirrus Logic, Dialog Semiconductor, DSP Group, Espressif, FujiFilm, GCT Semi, iCatch, InPlay, Intel, Itron, Leadcore, LG Electronics, Mediatek, Microchip, Nextchip, Nokia, Novatek, NXP, ON Semiconductor, Optek, Oticon, Panasonic, RDA, Renesas, Rockchip, Rohm, Samsung, Sanechips, Sharp, Siflower, SigmaStar, Socionext, Sony, Socionext, Sonova, STMicroelectronics, Toshiba, Unisoc, Vatics, Yamaha and ZTE all leverage Ceva’s industry-leading IP. These companies incorporate our IP into application-specific integrated circuits (“ASICs”) and application-specific standard products (“ASSPs”) that they manufacture, market and sell to consumer electronics companies. Headquartered in Rockville, Maryland, Ceva has over 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States, Serbia, and sales and support offices located in Europe, the U.S. and throughout Asia. Ceva is a sustainable and environmentally conscious company, adhering to our Code of Business Conduct and Ethics. As such, we emphasize and focus on environmental preservation, recycling, the welfare of our employees and privacy – which we promote on a corporate level. At Ceva, we are committed to social responsibility, values of preservation and consciousness towards these purposes.
Contact Ceva, Inc.

Learn more about Bluetooth IP core

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Frequently asked questions about Bluetooth IP cores

What is Bluetooth Connectivity Platform?

Bluetooth Connectivity Platform is a Bluetooth IP core from Ceva, Inc. listed on Semi IP Hub.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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