Vendor: Ceva, Inc. Category: Bluetooth

Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)

The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 4…

TSMC 22nm ULL In Production View all specifications

Overview

The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 40 MHz solution, a Bluetooth 5.4 dual-mode solution supporting LE and Classic Audio and numerous profiles, and an 802.15.4 solution for Zigbee, Thread and Matter compliance. These modules are pre-integrated with a single low-power 2.4 GHz radio implemented in TSMC 22 nm and their operation is orchestrated through smart coexistence mechanisms.

Key features

  • Highly versatile multi-protocol wireless connectivity solutions leveraging the latest and market proven Ceva-Waves integrated hardware IP and software platforms, including Wi-Fi, Bluetooth (Classic and LE), 802.15.4 (for Thread, Zigbee and Matter) and UWB
  • Optimized co-existence schemes for each specific configuration
  • Pre-integrated radio solutions, including RF from Ceva and various partners addressing a wide range of configurations and foundry process nodes
  • Easily adaptable to other RF implementations including customer’s own in-house developments
  • Hardware-accelerated embedded security modes and encryption to fully comply with the most demanding wireless-standard specifications
  • Complemented by Ceva’s extensive IP portfolio of Edge AI, audio, voice and sensing solutions

Block Diagram

Benefits

  • Turnkey integrated multi-protocol hardware and software platform
  • Faster TTF (Time to Fab) and TTM (Time to Market)
  • Integrated unified testbench
  • Optimized coexistence
  • Pre-adapted for TSMC 22nm ULL RF
  • Product specific customization available to fulfil project requirements

Applications

  • IoT, smart home, industrial, smart watch

What’s Included?

  • Hardware: verilog RTL, testbench, compilation, simulation and synthesis scripts
  • Software: C code packages for each wireless protocol
  • Documents

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULL In Production

Specifications

Identity

Part Number
Ceva-Waves Links100
Vendor
Ceva, Inc.

Provider

Ceva, Inc.
HQ: USA
The Smart Edge runs on Ceva! Ceva is the leader in innovative silicon and software IP solutions that enable smart edge products to connect, sense, and infer data more reliably and efficiently. At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years. With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 17 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva. We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically. Ceva is a trusted partner to over 400 of the leading semiconductor and OEM companies including Actions, Artosyn, ASR, Atmosic, Autotalks, Beken, Bestechnic, Brite, Broadcom, Celeno, Ceragon, Cirrus Logic, Dialog Semiconductor, DSP Group, Espressif, FujiFilm, GCT Semi, iCatch, InPlay, Intel, Itron, Leadcore, LG Electronics, Mediatek, Microchip, Nextchip, Nokia, Novatek, NXP, ON Semiconductor, Optek, Oticon, Panasonic, RDA, Renesas, Rockchip, Rohm, Samsung, Sanechips, Sharp, Siflower, SigmaStar, Socionext, Sony, Socionext, Sonova, STMicroelectronics, Toshiba, Unisoc, Vatics, Yamaha and ZTE all leverage Ceva’s industry-leading IP. These companies incorporate our IP into application-specific integrated circuits (“ASICs”) and application-specific standard products (“ASSPs”) that they manufacture, market and sell to consumer electronics companies. Headquartered in Rockville, Maryland, Ceva has over 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States, Serbia, and sales and support offices located in Europe, the U.S. and throughout Asia. Ceva is a sustainable and environmentally conscious company, adhering to our Code of Business Conduct and Ethics. As such, we emphasize and focus on environmental preservation, recycling, the welfare of our employees and privacy – which we promote on a corporate level. At Ceva, we are committed to social responsibility, values of preservation and consciousness towards these purposes.

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)?

Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter) is a Bluetooth IP core from Ceva, Inc. listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

×
Semiconductor IP