Vendor: Low Power Futures Category: Bluetooth

IP Platform for BLE 5.2 and 802.15.4 IoT Sensors

The LP1-220 IP Platform is built around the BLE 5.2 and 802.15.4 connectivity standards.

Overview

The LP1-220 IP Platform is built around the BLE 5.2 and 802.15.4 connectivity standards. This platform consists of a Bluetooth 5.2 Low Energy Controller and the 802.15.4 MAC and PHY. It also includes a sensor fusion IP, and the LP NNP IP. The LP1-220 IP Platform is designed to bring secure Bluetooth 5 and 802.15.4 wireless connectivity to various low-power application, including smart home, smart appliances and industrial IoT.
The LP1-220 IP Platform is fully integrated to ensure portability to different embedded processors. Its can be smoothly integrated into an SoC or used as the main foundation for a standalone SoC.

Key features

  • LE 5.2 CONTROLLER :
    • GFSK modem @ 2.4GHz (1M Uncoded PHY, 2M Uncoded PHY, 1M Coded PHY)
    • Bitstream Processing (FEC convolutional encoder/decoder, Data whitening, CRC, AES CCM)
    • Constant Tone Extension (IQ Sampling)
    • Channel Selection Algorithm for connection events and sub events
    • Broadcast Isochronous Stream
    • Connection Supervision
    • Link Layer Firmware and HCI
  • IEEE 802.15.4 CONTROLLER :
    • BPSK (20 Kbps @ 868 MHz, 40 Kbps @ 915 MHz
    • OQPSK (250 Kbps @2450 MHz/2380 MHz, 250 Kbps @ 915 MHz, 100 Kbps @ 868 MHz)
    • GFSK (100 Kbps @968 MHz)
    • Other optional modulation support
    • Bitstream processing (Channel coding, CRC, AES-CCM)
    • MAC Firmware
  • NEURAL NETWORK PROCESSOR :
    • Fully programmable
    • Int16
    • Fixed Point
    • FP16
    • Built-in prescaling and denormalization
  • SENSOR FUSION :
    • Kalman Filter Accelerator
    • Convolutional Neural Network
    • Hidden Markov
  • SECURITY ACCELERATOR :
    • Protocol Supported : ECDHE, ECDSA
    • Acceleration units : ECC-233, SHA256, AES 128
    • TRNG
  • AMBA standard interface : AXI/AHB/APB

Benefits

  • Power and area-optimized
  • Fully integrated for better portability to different embedded processors, including ARM and RISCV
  • Built for smooth integration into an SoC or used as the main foundation of a standalone SoC
  • Support for highly-differentiating products at a lower cost and time-to-market
  • Complete UVM Verification environment
  • End-to-end FPGA Validation Platform validated with qualified certification tools

Applications

  • Smart Home
  • Smart Appliance
  • Industrial IoT

What’s Included?

  • Delivered as Soft or Hard IP
  • Link Layer Firmware and HCI
  • FPGA Validation Platform
  • UVM Test Bench
  • Technical Specifications
  • Integration Manual

Files

Note: some files may require an NDA depending on provider policy.

Specifications

Identity

Part Number
LP1-220
Vendor
Low Power Futures

Provider

Low Power Futures
HQ: Canada
Low Power Futures is an industry leading low-power and ultra-low-power hardware and firmware IP for IoT. We enable the “Internet of Things” by providing innovative, power-efficient, highly integrated, secure and configurable IPs designed for low-power IoT systems. With LPF IP leverage reconfigurable technology for custom and optimize IoT chip solutions and products.

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Frequently asked questions about Bluetooth IP cores

What is IP Platform for BLE 5.2 and 802.15.4 IoT Sensors?

IP Platform for BLE 5.2 and 802.15.4 IoT Sensors is a Bluetooth IP core from Low Power Futures listed on Semi IP Hub.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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