40nm LPDDR2-PHY data block for SIP
40nm LPDDR2-PHY data block for SIP
- Controller + PHY + 1
- UMC
- 40nm
- LP
LPDDR Interface IP cores provide the controller, PHY, and training technologies required to connect SoCs and ASICs to low-power DRAM, enabling high memory bandwidth while minimizing energy consumption in power-sensitive applications.
This category includes IP solutions supporting LPDDR4, LPDDR5, LPDDR5X, and LPDDR6 memory standards. Available implementations may include memory controllers, PHYs, controller-PHY subsystems, initialization and training engines, power management features, ECC capabilities, and advanced signal integrity technologies optimized for mobile, AI, automotive, and edge computing platforms.
40nm LPDDR2-PHY data block for SIP
40nm LPDDR2-PHY data block for SIP
40nm LPDDR2-PHY command/address block for SIP
40nm LPDDR2-PHY command/address block for SIP
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
UMC 40nm LP process DDR34/LPDDR23 COMPENSATION Block with 2.5V Device
UMC 40nm LP process DDR34/LPDDR23 COMPENSATION Block with 2.5V Device
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), data block;UMC 40nm LP/RVT LowK Logic Process .
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), command / address block,UMC 40nm LP/RVT LowK Logic Process.
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for SIP Application; UMC 28nm HPC/RVT LowK Logic Process
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Log…
Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process
Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process