Learn more about USB IP core
To address the bandwidth limitations of the USB 2.0 interface, the USB Implementers Forum (USB-IF) released the SuperSpeed USB 3.0 specifications in November 2008. The USB 3.0 specification provides a maximum bandwidth of up to 5Gbps while limiting power consumption. In this white paper we present the features of the USB 3.0 protocol, discuss the new usage models it enables and compare it with some of the existing interface standards popular in the market today.
In an era defined by rapid technological advancement, embedded interfaces must evolve to meet the demands of smaller form factors, lower power budgets, and diversified use cases. Among these interfaces, eUSB2V2 (Embedded USB 2.0 Version 2) has emerged not just as a legacy-support PHY, but as a strategic enabler of robust, low-power connectivity across next-generation systems-on-chip (SoCs).
How do you incorporate quality into reusable IP? This white paper is about how it is done at Arasan Chip Systems, Inc.
With validation and software development becoming a prominent bottleneck in a project, progressive IP providers such as Arasan Chip Systems offer a Total IP Solution to address these demands. In this paper we explore the evolving SoC design model and propose a Total IP Solution approach as the next logical step for IP product companies.
Today’s complex silicon-on-chip (SoC) designs contain multiple instances of silicon intellectual property including CPUs, DSPs, and large numbers of interface IP—SD, SDIO, USB, and MIPI—to store and route video, audio, and data within these designs. On some large SoCs, as much as 85 percent of silicon real estate is made up of third party IP.
