Vendor: CrossFire Technologies Category: Custom

Direct Chiplet Interface

An optimum deployment of DCI in a Chipletized system would implement full DCI interfaces on all Chiplets.

Overview

An optimum deployment of DCI in a Chipletized system would implement full DCI interfaces on all Chiplets. To this end, CrossFire will be offering DCI in most flavors of TSMC silicon at 7nm and below.

If necessary, DCI can also be utilized in a multi-Chiplet system with limited DCI connectivity by working directly with CrossFire to optimize the other Chiplets via CrossFire’s proprietary post fab die processing capabilities to mostly achieve the lower power and improved performance characteristics of fully DCI connected systems

CrossFire will also consider working with a customer / standards body for a custom implementations of DCI - for example:

  • To reduce the power and die area of the proprietary interface of an Integratred Device Manufacter (IDM) or Fabless Semiconductor Company.
  • To enable the use of standard “on-chip” fabrid interfaces such as CHI or VCIX in Chipletized environments.
  • Improving the performance metrics of a standard off-chip interface such as CXL in a Chipletized environment

 

Files

Note: some files may require an NDA depending on provider policy.

Specifications

Identity

Part Number
DCI™
Vendor
CrossFire Technologies

Provider

CrossFire Technologies
HQ: USA
Crossfire Technologies Inc is solving the Accelerated Compute to Memory Bottleneck with its Patented and Proprietary portfolio of Chiplet Connectivity Solutions. Using its Chiplet integration processes, CrossFire easily integrates multiple Chiplets into a single component without using interposers, enabling Chiplet based wafer scale “MegaChips™ while reducing system costs, lowering system power, and reducing time to market. CrossFire’s ultra-low power Chiplet Connectivity Standard Bridgelets™ and related IP allow up to a 50x reduction in Die-to-Die interface area with per bit transfer energy transfers of < 0.025pJ / bit – lower than even monolithic on die implementations

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Frequently asked questions about Custom Die-to-Die IP cores

What is Direct Chiplet Interface?

Direct Chiplet Interface is a Custom IP core from CrossFire Technologies listed on Semi IP Hub.

How should engineers evaluate this Custom?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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