Low Power D2D Interface in TSMC 16nm FFC/FFC+
A 600MBps Low Power Die-to-Die Interface in TSMC 16nm FFC/FFC+.
Overview
A 600MBps Low Power Die-to-Die Interface in TSMC 16nm FFC/FFC+.
This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process. The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface. The RX cells have a weak pull-down feature.
Operating Conditions
| Parameter | Value |
| Core Device | FFC (0.8V) |
| I/O Device | 1.8V |
| Core | Uses SVT only |
| BEOL | 2Xa1Xd_h (M5 below) |
| PAD | Flipchip |
| Cell Size | 50um x 50um |
| VDDCore | 0.8V |
| Tj | -40C to 125C |
Library Cell Summary
| Cell Name | Description |
| VX_HSIO | Bidirectional I/O Cell |
Pin List
| Pin | Type |
| VDD | Power |
| VSS | Ground |
| DIN | Input 0.8V |
| OE | Input 0.8V |
| DOUT | Output0.8V |
| IE | Input 0.8V |
| PE | Input 0.8V |
| BUMP | OUT0.8V |
Block Diagram
Files
Note: some files may require an NDA depending on provider policy.
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 16nm | 16nm 160 nm | — |
Specifications
Identity
Provider
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Frequently asked questions about Custom Die-to-Die IP cores
What is Low Power D2D Interface in TSMC 16nm FFC/FFC+?
Low Power D2D Interface in TSMC 16nm FFC/FFC+ is a Custom IP core from Certus Semiconductor listed on Semi IP Hub. It is listed with support for tsmc.
How should engineers evaluate this Custom?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.