Provider
Cadence Design Systems, Inc.
HQ:
USA
If you want to achieve silicon success, let Cadence help you choose the right IP solution and capture its full value in your SoC design. Cadence® IP solutions offer the combined advantages of a high-quality portfolio, an open platform, a modern IP factory approach to quality, and a strong ecosystem.
Now you can tackle IP-to-SoC development in a system context, focus your internal effort on differentiation, and leverage multi-function cores to do more, faster.
The Cadence IP Portfolio includes silicon-proven Tensilica® IP cores, analog PHY interfaces, standards-based IP cores, verification IP cores, and other solutions as well as customization services for current and emerging industry standards. The Cadence IP Factory provides you with an automated approach to the customization, delivery, and verification of SoC IP. As a result, you can spend more time on differentiation, with the assurance that you'll meet your performance, power, and area requirements.
Choosing Cadence IP enables you to design with confidence because you have more freedom to innovate your SoCs with less risk and faster time to market.
Learn more about Ethernet IP core
Rambus, having successfully served the data center, enterprise and infrastructure markets with line rate MACsec and IPsec products (Secure Networking), adds two new solutions for securing UET transport protocol with TSS.
Ultra Accelerator Link (UA Link) standard has been specified to enable the creation of systems comprised of multiple nodes targeting AI applications.
As factories, process plants, and robotics platforms become increasingly intelligent and interconnected, the demand for stable, low-latency data links has pushed Ethernet deeper into embedded systems. However, since designing Ethernet connectivity into industrial chips comes with its technical and logistical hurdles, engineers may face challenges when implementing Ethernet in industrial designs.
Ultra Ethernet, designed for scale out architectures, is an open, interoperable, high-performance protocol solution tailored for AI, supported by industry leaders across switch, networking, semiconductor, and system providers, as well as hyperscalers.
At the recent ECOC 2025 conference in Copenhagen, Cadence showcased its key role in enabling the future of AI infrastructure with live silicon demonstrations of several essential IP technologies for emerging 800G and 1.6T networks. Powered by Cadence's 224G SerDes IP, Cadence's Ultra Accelerator Link (UALink 1.0) scale-up and Ultra Ethernet scale-out networking solutions deliver the performance, flexibility, and interoperability needed for next-generation AI factories and hyperscale data centers.
As artificial intelligence and high-performance computing (AI/HPC) reshape industries, the need for robust, scalable, and secure connectivity has never been greater. Built from tightly integrated CPUs, GPUs, and SmartNICs, today’s compute clusters demand high-throughput, low-latency networks that can scale from die-to-die to multi-rack deployments.
