Rambus Licenses DPA Countermeasures to Utimaco
Cutting-edge hardware-based security technologies protect against side-channel attacks
SUNNYVALE, Calif. – March 25, 2020 – Rambus Inc. (NASDAQ: RMBS) a premier silicon IP and chip provider making data faster and safer, today announced that it has signed a patent license agreement with Utimaco, a leading supplier of Hardware Security Modules (HSMs). The agreement includes the use of Rambus patents such as Differential Power Analysis (DPA) Countermeasures, which protect devices and integrated circuits against DPA and other related side-channel attacks. Specific terms of the agreement are confidential.
Developed by Rambus, DPA countermeasures incorporate extensive software, hardware and protocol techniques that protect devices from side-channel attacks, which are implemented in tamper-resistant products used in various applications. For more information on Rambus DPA Countermeasures and other security offerings, please visit https://www.rambus.com/security/.
Related Semiconductor IP
- Advanced DPA- and FIA-Resistant Software Library
- Programmable Root of Trust With DPA and FIA for US Defense
- Fast Public Key Engine with DPA or with DPA and FIA
- Fast Quantum Safe Engine for ML-KEM (CRYSTALS-Kyber) and ML-DSA (CRYSTALS-Dilithium) with DPA
- Programmable Root of Trust Family With DPA & Quantum Safe Cryptography
Related News
- Cryptography Research and Mikron JSC Sign Patent License Agreement for DPA Countermeasures
- Cryptography Research and CPU Tech Sign Patent License Agreement for DPA Countermeasures
- Cryptography Research and Discretix Sign Developer Agreement for DPA Countermeasures
- Cryptography Research and StarChip sign patent license agreement for DPA countermeasures
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release