Mindspeed Announces Definitive Agreement to Sell Assets of Its Wireless Infrastructure Unit to Intel
2013-12-16 04:39:00
Strategic Partnerships
Semiconductor IP News Archive - Page 846 of 1964
ARM Acquires Geomerics
2013-12-13 17:05:00
Strategic Partnerships
New technology consortium formed to develop innovative integrated Bluetooth Low Energy modules for SMEs
2013-12-13 16:38:00
Misc
Undo Software brings reversible debugging to ARM processors and Android Native
2013-12-13 09:09:00
SoC Architecture & Assembly
Yield And Reliability Issues With Integrating IP
2013-12-12 15:25:00
Analysis & Insight
Can Intel Dethrone The Foundry Giants?
2013-12-12 15:16:00
Analysis & Insight
Gartner Says the Internet of Things Installed Base Will Grow to 26 Billion Units By 2020
2013-12-12 14:44:00
Analysis & Insight
High-Speed Wireless Devices to Surge in Shipments, Thanks to Multistream Wi-Fi, WiGig and Other Similar Technologies
2013-12-12 08:06:00
Analysis & Insight
Brushless DC motor control solutions by Micronas now additionally powered by ARM Cortex-M3 Processor
2013-12-12 07:56:00
SoC Architecture & Assembly
Sckipio G.fast Technology Zooms Ahead with Arteris FlexNoC IP for Ultra-Fast Broadband
2013-12-11 17:56:00
Commercial Deals
Sckipio Technologies Completes $10M Investment Round to Create G.fast Modem Chips
2013-12-11 15:42:00
Strategic Partnerships
Imagination Technologies - Interim Results for the six months to 31 October 2013
2013-12-11 15:14:00
Financials
DELTA Microelectronics Teams with RacyICs for 28nm ICs
2013-12-11 13:48:00
Misc
Arasan Chip Systems Announces 64-bit Compatible Interface IP for Mobile Storage
2013-12-10 19:52:00
IP Cores & Design
Xilinx Doubles Industry's Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead
2013-12-10 15:17:00
SoC Architecture & Assembly
Synopsys Demonstrates Industry's First SuperSpeed USB 10 Gbps Platform-to-Platform Host-Device IP Data Transfer
2013-12-10 15:10:00
IP Cores & Design
DVSI Low Data Rate Speech Compression Software Available Now for Cadence Tensilica HiFi Audio/Voice DSP
2013-12-10 14:40:00
SoC Architecture & Assembly
Xilinx 20nm All Programmable UltraScale Portfolio Now Available with ASIC-class Architecture and ASIC-strength Design Solution
2013-12-10 13:49:00
SoC Architecture & Assembly
Qualcomm Technologies Introduces Snapdragon 410 Chipset with Integrated 4G LTE World Mode for High-Volume Smartphones
2013-12-10 09:55:00
SoC Architecture & Assembly
SEMI Reports Third Quarter 2013 Worldwide Semiconductor Equipment Figures; Billings $7.65 Billion
2013-12-10 09:26:00
Analysis & Insight