PLDA Further Strengthen Partner Ecosystem, Unveils Comprehensive PCIe PHY and Controller integrated Solutions, to be Presented at IP-SoC China 2017 2017-09-14 09:20:00 IP Cores & Design
EEMBC Benchmark Verifies Energy Cost of Integrated Microcontroller Peripherals 2017-09-14 09:03:00 SoC Architecture & Assembly
Flex Logix Wins TSMC Open Innovation Platform Partner Of The Year Award 2017 2017-09-14 08:37:00 Misc
Cadence Introduces the Conformal Smart Logic Equivalence Checker 2017-09-14 08:19:00 EDA & Design Tools
Xilinx Software Defined Development Environment for Data Center Acceleration Now Available on Amazon Web Services 2017-09-14 08:15:00 SoC Architecture & Assembly
Credo Demonstrates Single-Lane 112G and 56G PAM4 SerDes IP Solutions at TSMC 2017 OIP Ecosystem Forum 2017-09-13 16:32:00 Misc
UltraSoC expands to address embedded analytics market opportunity 2017-09-13 15:36:00 Strategic Partnerships
Synopsys and Alango Technologies Introduce Voice Enhancement Package Optimized for DesignWare ARC Data Fusion IP Subsystem 2017-09-13 15:15:00 IP Cores & Design
Packet Partners with Arm to Accelerate Adoption of Armv8-A for Datacenter Workloads 2017-09-13 10:21:00 SoC Architecture & Assembly
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 Design & Reuse IP SoC Event in Shanghai 2017-09-13 03:26:00 Misc
Sidense and Intellitech collaborate on Electronic Chip IDs, anti-counterfeiting and semiconductor security for Secure Supply Chain Enablement 2017-09-12 15:54:00 IP Cores & Design
Mobiveil Inc. and Crossbar Inc. Announce Partnership to Apply Mobiveil's NVMe Solid State Drive IP to Crossbar's ReRAM IP blocks 2017-09-12 15:45:00 IP Cores & Design
Synopsys and TSMC Collaborate to Develop DesignWare Foundation IP for Low-Power TSMC 40-nm eFlash Processes 2017-09-12 15:10:00 IP Cores & Design
Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution 2017-09-12 14:33:00 IP Cores & Design