Daimler AG Selects Xilinx to Drive Artificial Intelligence-Based Automotive Applications 2018-06-26 15:26:00 SoC Architecture & Assembly
Arbe Robotics Selects Synopsys' IP to Enable its High-Resolution Imaging Radar to Achieve the Highest Automotive Safety Level for Autonomous Vehicles 2018-06-26 15:09:00 Commercial Deals
Flex Logix EFLX4K IO eFPGA Core Enables Very Wide Bus Connections for Networking Applications 2018-06-26 14:04:00 IP Cores & Design
7nm networking platform delivers unprecedented performance and configurability for data center ASICs 2018-06-26 13:01:00 IP Cores & Design
Silicon Creations' SerDes Technology Helps Power Leading-Edge 8K TV 2018-06-26 11:18:00 Commercial Deals
General Processor Technologies Announces AI Accelerator and DSP for Digital and Image Processing 2018-06-26 09:22:00 IP Cores & Design
Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications 2018-06-26 09:10:00 IP Cores & Design
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment - SAVE 2018-06-26 07:58:00 EDA & Design Tools
Optimum Semiconductor Unveils New Image Recognition SoC 2018-06-26 03:04:00 SoC Architecture & Assembly
Eta Compute and ROHM Semiconductor Collaborate to Create Low Power Wi-SUN Compatible Sensor Nodes 2018-06-25 22:25:00 SoC Architecture & Assembly
Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors 2018-06-25 16:50:00 EDA & Design Tools
Arteris IP and Magillem Partner to Create Integrated System-on-Chip Architecture Environment 2018-06-25 15:40:00 Strategic Partnerships
NetSpeed launches SoCBuilder - AI-powered design and integration platform to accelerate SoC designs 2018-06-25 14:24:00 IP Cores & Design
Flex Logix Improves Deep Learning Performance By 10X With New EFLX4K AI eFPGA Core 2018-06-25 14:16:00 IP Cores & Design
C-SKY Microsystems Selects QuickLogic as Their Strategic eFPGA Partner by Signing Master Technology License Agreement 2018-06-25 13:56:00 SoC Architecture & Assembly
Moortec Supporting Today's Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution 2018-06-25 13:23:00 IP Cores & Design
CEVA Extends its Leadership in NB-IoT IP with CEVA-Dragonfly NB2, the World's First eNB-IoT Rel14 Solution 2018-06-25 13:10:00 IP Cores & Design
Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications 2018-06-25 09:33:00 IP Cores & Design
Gidel Launches Lossless Compression IP that Reduces Storage Needs by Over 50%, Utilizing Only 1% of the FPGA, with Low Power Consumption 2018-06-25 09:27:00 IP Cores & Design