CEVA to Showcase Continued Leadership in Intellectual Property for Wireless Handset Applications at 3GSM World Congress 2007 2007-01-31 16:01:00 Misc
Digital Blocks Announces the DB9000AVLN TFT LCD Controller IP Core 2007-01-31 15:43:00 IP Cores & Design
Epson Announces Long-Term Strategic Relationship with Tensilica for New REALOID Printer Engine Chip With Multiple Tensilica Configurable Processors and Future REALOID Designs 2007-01-30 09:58:00 Commercial Deals
CAST Expands Memory Controller Line with IP Core for DDR2 SDRAM Devices 2007-01-30 09:53:00 IP Cores & Design
CAST Introduces SOC Kernels, Combining Essential IP Cores and Software for Easier System Development 2007-01-30 09:46:00 IP Cores & Design
Synopsys Named IBM-Authorized Power Architecture Design Center; Synopsys to Directly License Foundry-Portable PowerPC Cores 2007-01-30 09:41:00 IP Cores & Design
Sony Renews and Updates License for Tensilica's Xtensa LX2 Configurable Processor 2007-01-30 08:55:00 Commercial Deals
Altera's FPGAs Are First to Demonstrate Support for PCI Express 2.0 2007-01-30 01:18:00 SoC Architecture & Assembly
Altera, National Semiconductor and MorethanIP Announce First 8-Port Switch Development Board With IEEE 1588 Timing Control 2007-01-29 16:15:00 Misc
Virage Logic Launches Next Generation Embedded Non-Volatile Memory 2007-01-29 15:13:00 IP Cores & Design
Actel Champions Embedded Systems Designers With Broad Range of Industry-Standard Processor Solutions 2007-01-29 14:23:00 IP Cores & Design
YOGITECH Launches Industry First SIL3 Compliant IP For Safety-Critical Systems 2007-01-29 13:49:00 IP Cores & Design
Handshake Solutions launches Memory eXtension to clockless HT80C51 core 2007-01-29 13:12:00 IP Cores & Design
VeriSilicon Launches New Families of Advanced Audio / Video Application Platforms to Accelerate Portable Multimedia Designs 2007-01-29 12:51:00 IP Cores & Design
Motorola Expands Strategic Relationship With Texas Instruments to Include High-Volume 3G, WiMAX and OMAP(TM) Technologies 2007-01-29 05:41:00 SoC Architecture & Assembly
OKI, Faraday Technology, and UMC/UMCJ Partner to Deliver 90 nm and Below Design-to-Manufacture Services for consumer market 2007-01-29 03:31:00 Strategic Partnerships
eASIC and MoreThanIP Partner to Deliver Tri-Mode (10/100/1000) Ethernet MAC Solutions for Nextreme Structured ASICs 2007-01-29 02:42:00 Misc
Fukuoka Intelligent Cluster Laboratory Chooses eASIC’s Nextreme Devices for its Unique System-in-Package (SiP) Development 2007-01-29 02:24:00 Misc