OCP-IP Delivers Memory Model Package
2011-06-08 07:27:00
EDA & Design Tools
Semiconductor IP News Archive - Page 1057 of 1964
Accent Announces Availability of Advanced Metrology Solution for Smart Grid Market
2011-06-08 01:00:00
SoC Architecture & Assembly
Triad Semiconductor secures $6M funding from new investor Development 72, LLC
2011-06-07 22:57:00
Strategic Partnerships
Kaben Wireless Announces Programmable JAT
2011-06-07 22:33:00
IP Cores & Design
ALLEGRO DVT now targets Wireless Display (WiDi) with its ultra-low latency H.264 IP cores.
2011-06-07 22:29:00
IP Cores & Design
CEVA and Carbon Design Systems Partner to Offer Fast Simulation Models for CEVA DSPs
2011-06-07 22:23:00
EDA & Design Tools
Open-Silicon and Micron Align to Deliver Next-Generation Memory Technology
2011-06-07 14:48:00
Strategic Partnerships
Sonics Announces Innovative Design Environment for Accelerating Network-on-Chip Configuration
2011-06-07 09:00:00
IP Cores & Design
Jasper to Release First of Its Kind System-Level Verification IP (VIP) for ARM ACE-based SoCs
2011-06-07 08:46:00
Verification IP
Samsung Qualifies 28nm LP Process Technology for High Performance Mobile Applications
2011-06-07 08:42:00
Foundries & Process Nodes
Open-Silicon Collaborates with GLOBALFOUNDRIES on 28nm Low-Power Solutions
2011-06-07 06:50:00
Misc
Dini Group Selected by Cadence to supply high-capacity FPGA-boards
2011-06-07 06:47:00
Misc
Rambus and Freescale Sign Patent License Agreement
2011-06-07 06:34:00
Legal & IP Strategy
Cadence Accelerates Development of Multiprocessor Mobile Devices with New ARM ACE Verification IP
2011-06-06 17:16:00
Verification IP
Vitesse Gigabit Ethernet IP Cores Enable Proliferation of Ethernet Applications
2011-06-06 16:36:00
IP Cores & Design
Sidense First to Offer Antifuse OTP Supporting 1.8V IO in 40nm and 28nm Process Nodes
2011-06-06 15:15:00
IP Cores & Design
ARM and Synopsys Sign Multi-Year EDA Tools and ARM Cortex-A15 Access Agreements
2011-06-06 14:35:00
Strategic Partnerships
Cadence Extends IP Offering, Collaborates with TSMC via Open Innovation Platform
2011-06-06 14:15:00
IP Cores & Design
Sonics Named as Early Supporter for Phase Two of the AMBA 4 Specification
2011-06-06 14:01:00
EDA & Design Tools
Sonics Announces Support for TSMC's Reference Flow 12
2011-06-06 13:08:00
EDA & Design Tools