Latest Synopsys FPGA-Based Prototyping Tool Releases Improve Speed and Turnaround Time 2011-11-16 15:07:00 EDA & Design Tools
Aspex Semiconductor wins National Microelectronics (NMI) Lower Power Green award for HD video compression technology 2011-11-16 14:47:00 Misc
Xilinx Announces Key Connectivity IP Cores for Next Generation LTE and LTE-A Wireless Infrastructure Equipment 2011-11-16 13:12:00 IP Cores & Design
Astrodesign new 4K Codec system powered by intoPIX JPEG 2000 technology 2011-11-16 07:17:00 Commercial Deals
Sonics Continues Lawsuit Against Arteris for Patent Infringement 2011-11-15 15:58:00 Legal & IP Strategy
Altera Announces Industry's First OpenCL Program for FPGAs 2011-11-15 15:06:00 SoC Architecture & Assembly
Quantenna Launches World's First 802.11ac Gigabit-Wireless Solution for Retail Wi-Fi Routers and Consumer Electronics 2011-11-15 14:55:00 SoC Architecture & Assembly
CEVA-TeakLite-III DSP Offers First IP Core Approved for Dolby MS11 Multistream Decoder 2011-11-15 14:02:00 IP Cores & Design
Xilinx Enables Cable Operators to Future-Proof Headends to Deliver More Compelling Triple-Play Services to the Home 2011-11-15 13:59:00 SoC Architecture & Assembly
Microsemi, MIPS Technologies, Oberthur, Renesas and Technikon join the HIS Initiative 2011-11-15 07:59:00 Misc
Multimedia and connectivity technologies transforming much wider markets than just smartphones, says Imagination 2011-11-15 07:24:00 Misc
Cryptography Research and Mikron JSC Sign Patent License Agreement for DPA Countermeasures 2011-11-15 01:22:00 Commercial Deals
CM Engineering standardizes on Springsoft's Verdi Debug in Advanced Chip Verification Environment 2011-11-15 01:07:00 EDA & Design Tools
Intilop Corporation to showcase their 3rd Generation Enhanced Ultralow latency 10G bit TCP Offload Engine and Total system solutions for the Financial Markets at the Team-A Low Latency Summit 2011-11-15 01:06:00 Misc
Barcelona Supercomputing Center to Deploy World's First ARM-Based CPU/GPU Hybrid Supercomputer 2011-11-14 15:43:00 SoC Architecture & Assembly