Tesla Considers Building ‘Tera Fab’ to Meet Future Chip Needs
By Nitin Dahad, EETimes | November 7, 2025

An upbeat Elon Musk, with his newly approved trillion-dollar pay package, talked to a very select group of investors at the Tesla annual shareholders meeting yesterday in Austin, Texas, and told the audience he had chips on his brain and planned to build a “Tera fab” that could potentially produce a million wafer starts per month to meet chip demand for Tesla alone.
Musk said that all he could think about was chips at the moment. He also said that with his AI5 chip and the planned AI6 chip, he did not think existing suppliers (TSMC and Samsung) could meet demand. As a result, he would consider some collaboration with Intel and also building Tesla’s own “Tera fab” to meet demand for Tesla’s own products.
To read the full article, click here
Related Semiconductor IP
- 8MHz / 40MHz Pierce Oscillator - X-FAB XT018-0.18µm
- UCIe RX Interface
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
Related News
- Tera Systems' Tool Adopted by NEC Electronics for RTL Design Closure and Virtual Prototyping <!-- verification -->
- Chip Express, Lightspeed, Synplicity, and Tera Systems Team Up to Establish the “Structured ASIC Association”
- Teradici Licenses MIPS Technologies' Most Popular Embedded Processor for Innovative TERA Chipset in Datacenter-Based Computing
- TSMC Plans New Fab for 3nm
Latest News
- ASICLAND Expands Global Footprint Following U.S. BrainChip Collaboration, Advances Entry into Malaysia
- ASICLAND Reports 2025 Revenue of KRW 72.8 Billion, Positions for Future Growth Through Strategic Investments
- SEMIFIVE Pulls Ahead in AI ASIC Market, Expanding Lead with Successive NPU Project Wins
- M31 Reports Record NT$1.78 Billion Revenue in 2025 as Advanced Node Royalties Begin to Emerge
- Silvaco Reports Fourth Quarter and Full-Year 2025 Financial Results