Socionext showcase cutting-edge SoC solutions at Embedded World 2024
February 6, 2024 --- Socionext Europe, a global specialist in customized SoC-based solutions, will grace the halls of Embedded World 2024, Nuremberg 09 - 11 April 2024 | Booth 4A – 628.
The highly anticipated event, renowned as the globe's leading meeting place for the international embedded community, will advance the conversation on embedded systems, focusing on security for electronic systems, distributed intelligence, IoT, and e-mobility.
Socionext seizes this opportunity to showcase its latest innovations, including its ground-breaking 60 GHz radar sensor technology for interior use cases, and to accelerate international networking with a congregation of industry professionals, innovators, and thought leaders.
Visitors will find Socionext's booth conveniently located at Booth 4A - 628, where the company's team will provide live demonstrations of their technology, answer queries, and facilitate engaging discussions.
As the date approaches, Socionext invites attendees of Embedded World 2024 to visit the company's booth to discover the transformative potential of its newest SoC solutions.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- VeriSilicon showcased its latest power-efficient IP applications at Embedded World 2024
- Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- Socionext to Showcase Advanced SoC Technologies at Embedded World 2025
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack