SilTerra Ready For 110nm CMOS Logic Technology Pilot Production
- SilTerra Malaysia Sdn. Bhd., a leading wafer foundry provider, has officially debut the industry foundry compatible copper-based 110nm CMOS Logic Technology as the 10% optical shrink for it's copper-based 130nm CMOS Logic Technology, which has been in mass production for more than 2 years. The technology, code name CL110G, applies 10% linear optical shrink on customer 130nm database. The electrical device specification and SPICE model of CL110G are optimized to match with the original 130nm design. The CL110G technology is developed with advanced processing tools to enhance yield performance.
"Customers could take advantage of the new CL110G platform to squeeze extra dies per wafer with uncompromised device performance. Customer will gain about 19% of extra die per wafer with reference to the pure digital 130nm CMOS Logic design. CL110G is now ready for customers' prototypes and we are excited by the level of enthusiasm from our customers all over the world. In the current economy downturn, consumers are more cost conscious but their appetite for high performance and low power handheld gadgets remains high. Our customers are aggressively looking for solutions to serve this market better and they find this technology offers a timely solution for them to engage the new opportunity especially in emerging markets such as China and India" said Yit Loong Lai, Vice President of Worldwide Sales & Marketing.
Silterra's CL110G technology is optimized for high performance and high density complex design with demanding product performance. This technology features eight layers of dual damascene copper metallization, borderless contacts and vias with FSG inter-metal dielectric. The technology is supported by a complete set of foundry foundation Intellectual Property (IP) from Virage Logic, ARM and other silicon IP providers to help our customers shorten time-to-market and reduce development cost. The design flow is also validated in Synopsys and Mentor Graphic platforms.
About SilTerra Malaysia Sdn Bhd:
Market driven, SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible CMOS logic, high-voltage and mixed-signal/RF technologies down to 90nm feature size. The broad choice of mature technologies and IP's, flexibility and capabilities enable Silterra to serve broad range of customers from fabless to IDM in highly dynamic consumer electronics and communication applications. SilTerra's wafer fab has a designed capacity of 40,000 eight-inch wafers per month.
Environmentally vigilant, SilTerra delivers award winning, world-class performance to its customers seeking flexible capacity, competitive advantages and around the clock customer support. SilTerra is ISO 9001:2000 and ISO 14001 certified. Founded in 1995, the company's headquarters and factory are located in Malaysia's Kulim High-Tech Park, and SilTerra has sales and marketing offices in San Jose (California) and Hsinchu (Taiwan).
For additional information on SilTerra or its services, please visit www.silterra.com.
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- Silterra and eMemory Offer CMOS Logic-Based OTP Memories
- SilTerra launches 130nm CMOS Logic Aluminum Backend Technology
- SST and SilTerra Announce Production Readiness of Embedded SuperFlash Macros on SilTerra's 180 nm CMOS Platform
- People in the News: IP analyst joins ISS as marketing chief; Robison named chairman of startup Alchemy; Silterra strengthens sales team; other executive moves
Latest News
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations