North American Semiconductor Equipment Industry Posts August 2020 Billings
North American Semiconductor Equipment Industry Posts August 2020 Billings
MILPITAS, Calif. — September 21, 2020 — North America-based manufacturers of semiconductor equipment posted $2.65 billion in billings worldwide in August 2020 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 3.0 percent higher than the final July 2020 level of $2.57 billion, and is 32.5 percent higher than the August 2019 billings level of $2.00 billion.
“August billings of North America-based semiconductor equipment manufacturers demonstrate solid performance and strong year-over-year growth,” said Ajit Manocha, SEMI president and CEO. “Semiconductor equipment demand remains robust despite supply chain uncertainties and new regulatory constraints.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Billings | Year-Over-Year | |
March 2020 | $2,213.1 | 21.2% |
April 2020 | $2,281.3 | 18.7% |
May 2020 | $2,343.3 | 13.5% |
June 2020 | $2,317.7 | 14.4% |
July 2020 (final) | $2,575.3 | 26.7% |
August 2020 (prelim) | $2,653.3 | 32.5% |
Source: SEMI (www.semi.org), September 2020
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more
Related Semiconductor IP
- RISC-V CPU IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
Related News
- North American Semiconductor Equipment Industry Posts August 2017 Billings
- North American Semiconductor Equipment Industry Posts August 2018 Billings
- North American Semiconductor Equipment Industry Posts August 2019 Billings
- North American Semiconductor Equipment Industry Posts July 2020 Billings
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers