Samsung to triple foundry capacity
By David Manners, ElectronicsWeekly (October 28, 2021)
Earlier today, Samsung said it plans to triple its foundry capacity by 2026.
“We plan to expand our capacity about three times by 2026 to meet customers’ needs as much as possible by expanding capacity in Pyeongtaek as well as considering establishing a new plant in the U.S.,” says Samsung’s Han Seung-hoo.
Han said that Samsung will be producing 3nm foundry chips in H1 2022 and expects to have a second generation 3nm process in 2023.
To read the full article, click here
Related Semiconductor IP
- RVA23, Multi-cluster, Hypervisor and Android
- 64 bit RISC-V Multicore Processor with 2048-bit VLEN and AMM
- NPU IP Core for Mobile
- SLM SHS IP
- NVMe 2.2 Verification IP
Related News
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
- Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology
- Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process
- Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
Latest News
- InCore Unveils SoC Generator Platform: From Idea to FPGA Validation in Minutes; Demonstrates Silicon Proof of Auto-Generated SoC
- Safety Without Security Is an Illusion in the Age of Autonomous Vehicles
- M31 Ranked in the Top 5% of TPEx-Listed Companies in the Corporate Governance Evaluation for Four Consecutive Years
- SmartDV Introduces Advanced H.264 and H.265 Video Encoder and Decoder IP
- Volantis Unveils Photonic Compute Platform for the AI Era; Raises $9M in Seed Round With Alex Wang, Trevor Blackwell, and Others