Rambus and Socionext Sign Broad Patent License Agreement
Agreement includes access to a wide range of high-speed interface and security innovations
SUNNYVALE, Calif., – July 17, 2018 – Rambus Inc. (NASDAQ: RMBS) today announced that Socionext, a leader in state-of-the-art system-on-chip technology, has signed a patent license agreement. Under the terms of the agreement, Rambus will license Socionext a broad range of innovations related to memory controllers, SerDes and security technologies. Specific terms of the contract are confidential.
“This agreement is a significant achievement, providing innovations that complement Socionext’s existing SoC offerings to provide the next generation of leading-edge solutions in imaging, networking and computing,” said Kit Rodgers, SVP of Technology Partnerships and Corporate Development at Rambus
For additional information on Rambus products and solutions, please visit rambus.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Rambus and Socionext Renew Patent License Agreement
- Rambus and Micron Extend Patent License Agreement
- Rambus and AMD Extend Patent License Agreement
- Rambus and Kioxia Renew Patent License Agreement
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack