Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP
SUNNYVALE, Calif. – Aug. 27, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced the completion of the previously-disclosed acquisition of Northwest Logic, a leading supplier of memory, PCIe and MIPI digital controllers. This acquisition allows Rambus to further scale, bringing together high-speed design expertise with the physical and digital IP families from renowned market leaders to offer comprehensive memory and SerDes IP solutions for chip designers.
“Northwest Logic’s product lineup and expertise is a great complement to our current portfolio, expanding and deepening our high-speed interface offerings in a wide array of high-performance markets,” said Luc Seraphin, president and CEO, Rambus. “The addition of their solutions and technology serves a critical role in driving Rambus’ continued focus on our core strengths in semiconductor.”
Although this transaction will not materially impact 2019 financial results due to the timing of close and acquisition accounting, Rambus expects this acquisition to be accretive in 2020.
For more information about the acquisition, visit rambus.com/northwestlogic.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Northwest Logic Offers MRAM Controller IP compatible with Everspin's ST-MRAM
- Northwest Logic and S2C Deliver Validated MIPI Solution
- eSilicon, Northwest Logic and SK Hynix create high-bandwidth memory (HBM) hardware demonstration
- Northwest Logic Uses Avery Design System’s High Bandwidth Memory (HBM) Model to Verify Its High-Performance HBM Controller IP Core
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack