Rambus Files Patent Infringement Suit Against Micron
Delaware judge lifts stay permitting new case to move forward asserting additional patents on DDR2, GDDRx and other memory products
LOS ALTOS, California, United States - January 13, 2006 -- Rambus Inc. (Nasdaq:RMBS) today announced that it has filed a new patent infringement case against Micron Technologies (NYSE:MU) following the lifting of a stay by the Delaware court. In the case filed today, Rambus asserts infringement of its patents by DDR2, GDDR2 and GDDR3 and other memory devices that are currently shipping in the marketplace.
“These are complex cases that merit coordinated decision making,” said John Danforth, senior vice president and general counsel at Rambus. “With today’s order and our new filing, we are taking steps consistent with the nature of these cases and with our efforts over the past four years to see them resolved in California. While we prefer to resolve issues outside of the courtroom, we believe we have a strong patent position, including patents that issued in the past four years that must be defended appropriately.”
Today’s filing asserts Micron memory products infringe additional features covered by Rambus patents that are incorporated into Micron’s DDR2, GDDRx and other advanced memory products. The case filed today against Micron has been described by Rambus as a case related to currently pending cases before the Honorable Ronald Whyte: Hynix v. Rambus; Rambus v. Samsung; and Rambus v. Hynix/Samsung/Nanya.
The complaint filed today is available on Rambus’ website at http://investor.rambus.com (under Litigation Update section).
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus’ interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, California, with regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com.
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- UMC Files Patent Infringement Lawsuit against Micron
- Microchip Technology Files Patent Infringement Suit Against ZiLOG, Inc.
- Qualcomm Files GSM Patent Infringement Suit Against Nokia
- MEMC Conducts Seizure and Files Suit Against Soitec for Patent Infringement
Latest News
- Alphawave IP Response to announcement from Qualcomm
- Qualcomm considers buying Alphawave Semi
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration