SEMI Reports First Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $13.1 Billion
MILPITAS, Calif. — June 5, 2017 — SEMI, the global industry association representing the electronics manufacturing supply chain, today reported that worldwide semiconductor manufacturing equipment billings reached US$13.1 billion for the first quarter of 2017. The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record.
Quarterly billings of US$13.1 billion also represent the first time quarterly billings exceeded the record quarterly high set in the third quarter of 2000. Billings for the most recent quarter are 14 percent higher than the fourth quarter of 2016 and 58 percent higher than the same quarter a year ago. The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 95 global equipment companies that provide data on a monthly basis.
The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:
1Q2017 | 4Q2016 | 1Q2016 | 1Q2017/4Q2016 | 1Q2017/1Q2016 | |
Korea | 3.53 | 2.39 | 1.68 | 48% | 110% |
Taiwan | 3.48 | 4.15 | 1.89 | -16% | 84% |
China | 2.01 | 1.15 | 1.60 | 74% | 25% |
North America | 1.27 | 1.24 | 1.01 | 3% | 26% |
Japan | 1.25 | 1.05 | 1.24 | 19% | 1% |
Europe | 0.92 | 0.93 | 0.35 | -1% | 160% |
Rest of World | 0.63 | 0.60 | 0.51 | 4% | 23% |
Total | 13.08 | 11.52 | 8.28 | 14% | 58% |
Source: SEMI (www.semi.org) and SEAJ, June 2017
The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Billings Report, which offers a perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments; and the SEMI Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online: www.semi.org/en/MarketInfo/EquipmentMarket.
About SEMI
SEMI® connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- SEMI Reports Second Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $14.1 Billion
- Worldwide Semiconductor Market growth is expected to be up 17 percent in 2017 after 1.1 percent growth in 2016.
- North American Semiconductor Equipment Industry Posts July 2017 Billings
- North American Semiconductor Equipment Industry Posts August 2017 Billings
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale