X-FAB Releases Ready-to-Use Design IP Blocks for MEMS Accelerometers
X-FAB Silicon Foundries today added ready-to-use design IP blocks for acceleration sensors to its MEMS foundry service offerings.
Erfurt, Germany, June 1, 2011. X-FAB Silicon Foundries today added ready-to-use design IP blocks for acceleration sensors to its MEMS foundry service offerings. Developed in cooperation with MicroMountains Applications and HSG-IMIT (Institute for Microtechnology and Information Technology of Hahn-Schickard-Gesellschaft), the new IP blocks can be incorporated into customer designs of MEMS capacitive accelerometers covering 2G, 10G and 100G ranges (G = G-force). The accelerometer IP design blocks further shorten design times and reduce customer learning cycles for new product introduction. Running on X-FAB’s advanced open platform inertial sensor process, the fully characterized IP blocks give customers the industry’s fastest development times for volume manufacture of gyroscope and accelerometer designs. The accelerometer IP provides design blocks that can be used as is for fully characterized accelerometers that are ideal for a wide range of applications – from motion sensing for games and toys to crash-detection for the automotive market.
“Working closely with HSG-IMIT and MicroMountains Applications to develop ready-to-use design IP blocks, X-FAB is changing the game and taking another step away from the one-product, one process rule that dominates MEMS,” said Iain Rutherford, Business Line Manager for MEMS, X-FAB. “By offering this IP in conjunction with our proven, inertial sensor process, we can help companies leap into the accelerometer market with the fastest development times in the industry for such a complex MEMS device.”
The IP block development was done in cooperation with MicroMountains Applications and HSG-IMIT, creating IP for three broad application spaces. Development also included finite element analysis simulation of the sensor elements to gather important information about sensitivity, shock-resistance and frequency behavior of the structures. After manufacturing the devices using X-FAB’s inertial sensor process platform, HSG-IMIT performed full characterization of the accelerometers. This was done using different rate-tables for 3-axis-simulation, temperature and vacuum in addition to shakers and temperature-chambers.
Availability
The new IP blocks are available now.
About X-FAB
X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related News
- mCube Redefines MEMS Sensor Innovation by Unveiling the World's Smallest 1x1mm Accelerometer
- MEMSensing Launches the World's Smallest Commercial 3-Axis Accelerometer MSA330 with SMIC
- Ohio team studies friction shortfalls of MEMS
- MEMSCAP Delivers MEMS Design Platform Through Cadence Platinum Program
Latest News
- Cadence Reports Second Quarter 2025 Financial Results
- Rambus Reports Second Quarter 2025 Financial Results
- QuickLogic Unveils Aurora PRO: 50% Better Resource Utilization & 35% Faster Fmax
- Intel facing another crossroads: 18A or 14A process node
- Creonic Successfully Renewed its ISO 9001:2015 Certification