Intel Halts Products, Slows Roadmap in Years-Long Turnaround
By Alan Patterson, EETimes (February 3, 2025)

Intel has scrapped product launches and slowed its process technology roadmap as it embarks on a path toward a rebound that will take years, according to analysts surveyed by EE Times.
The company’s new top management, Michelle Holthaus and David Zinsner, are more realistic on challenges from competitors like AMD in processors and TSMC in the foundry business, according to C.J. Muse, Senior Managing Director of Cantor Fitzgerald.
“Intel’s new co-CEOs hosted their first conference call with commentary balanced and realistic, highlighting the meaningful challenges ahead at Intel and the view that there are no quick fixes, unfortunately,” Muse said in a report provided to EE Times.
To read the full article, click here
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- Artisan Components Furthers Library Roadmap with TSMC 0.13-Micron Agreement
- 1999 roadmap targets new 'performance SoC' category
- Intel and ARM Finalize Architecture Roadmap Licensing Agreement
- Actel Details Next Phase In Space-Qualified FPGA Roadmap; Aggressively Targets Satellite Payload Applications
Latest News
- MIPI Specifications for Embedded Audio, Ambient AI, Smart Camera, IoT and Medical to be Featured at 2026 embedded world Exhibition & Conference
- M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications
- ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion