Intel Halts Products, Slows Roadmap in Years-Long Turnaround
By Alan Patterson, EETimes (February 3, 2025)
Intel has scrapped product launches and slowed its process technology roadmap as it embarks on a path toward a rebound that will take years, according to analysts surveyed by EE Times.
The company’s new top management, Michelle Holthaus and David Zinsner, are more realistic on challenges from competitors like AMD in processors and TSMC in the foundry business, according to C.J. Muse, Senior Managing Director of Cantor Fitzgerald.
“Intel’s new co-CEOs hosted their first conference call with commentary balanced and realistic, highlighting the meaningful challenges ahead at Intel and the view that there are no quick fixes, unfortunately,” Muse said in a report provided to EE Times.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- Artisan Components Furthers Library Roadmap with TSMC 0.13-Micron Agreement
- 1999 roadmap targets new 'performance SoC' category
- Intel and ARM Finalize Architecture Roadmap Licensing Agreement
- Actel Details Next Phase In Space-Qualified FPGA Roadmap; Aggressively Targets Satellite Payload Applications
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications