European report considers 450-mm More-than-Moore fab
Peter Clarke, EETimes
6/6/2012 6:34 AM EDT
LONDON – A report prepared for the European Commission just published discusses the potential role of European authorities in encouraging the creation of both a pilot 450-mm wafer fab to support Europe's chip equipment companies and a volume manufacturing 450-mm plant for a wide variety of More-than-Moore processes.
The report, entitled Benefits and measures to set up 450 mm semiconductor prototyping and to keep semiconductor manufacturing in Europe. The role of public authorities and programmes has been prepared between January 2011 and February 2012 by the consultancies Future Horizons Ltd. (Sevenoaks, England) and Decision SA (Paris, France).
To read the full article, click here
Related Semiconductor IP
- 8MHz / 40MHz Pierce Oscillator - X-FAB XT018-0.18µm
- UCIe RX Interface
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
Related News
- NEC Electronics Europe introduces µClinux operating system for System-on-Chip Lite+
- ARC Technology Chosen by Fujitsu Microelectronics Europe For Next-Generation Consumer Applications
- NEC Electronics Europe releases low-cost System-on-Chip Lite+ starter kit
- ST reveals plan to cut 2,300 jobs in Europe
Latest News
- Silvaco Reports Fourth Quarter and Full-Year 2025 Financial Results
- Klepsydra Technologies and BrainChip Announce Strategic Partnership to Deliver Heterogeneous AI Runtime for Akida™ Neuromorphic Processors
- Alchip Reports ASIC-Leading 2nm Developments
- AI Demand Drives 4Q25 Global Top 10 Foundries Revenue Up 2.6% QoQ; Samsung Gains Share and Tower Moves Up in Rankings
- GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications