Dolphin Integration appoints Philippe Berger as Chief Executive Officer
Berger brings deep semiconductor industry and leadership experience
Grenoble, France, January 25, 2019 -- Dolphin Integration, a global leader in the development of silicon IPs and integrated circuit design services, announced today that they have appointed Philippe Berger as their new Chief Executive Officer to lead the company in its next phase of innovation and growth. Philippe Berger brings to Dolphin Integration over 30 years of experience leading semiconductor engineering and operations in Europe.
Previously in his career, Philippe held senior executive level roles managing, product division, corporate R&D services, global operations for leading semiconductor organizations such as STMicroelectronics, ST-Ericsson, Ericsson, and Idemia. Prior to that, Philippe started his career as an analog IC designer. Most recently, before joining Dolphin Integration, he worked as strategy and development advisor for SMEs.
“It will be a huge privilege to lead Dolphin Integration – a global company leading innovation of tomorrow’s electronic systems (across IoT, mobile, automotive, AI) requiring energy efficient high-performance solutions,” said Philippe Berger. “I look forward to working with this world-class team to help them meet the ongoing challenges of the semiconductor industry, to deliver value to customers, and to accelerate long-term profitable growth.”
Founded in 1985, Dolphin Integration currently employs 160 employees in their head office located in Meylan, France and operates subsidiaries in Canada and Israel. The company currently services more than 100 customers globally.
About Dolphin Integration
Headquartered in France, Dolphin Integration develops silicon IPs serving high volume customers worldwide and offers integrated circuit design services to the European Defense and Aerospace industry.
Conscious of AI, IOT, mobile and automotive products’ explosive growth and potential environmental impact, Dolphin Integration is committed to accelerating the development of energy-efficient System-on-Chip (SoC) designs for its customers.
To learn more about the company, please visit: www.dolphin-integration.com.
Related Semiconductor IP
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
- Voltage and Temperature Sensor with integrated ADC - GlobalFoundries® 22FDX®
- 8MHz / 40MHz Pierce Oscillator - X-FAB XT018-0.18µm
Related News
- Dolphin Integration Appoints Christian Dupont as CEO
- Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
- Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box
- Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box
Latest News
- Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
- CHERI-Mocha memory-safe compute subsystem is now open
- GlobalFoundries Files Patent Infringement Lawsuits Against Tower Semiconductor to Protect High-Performance American Chip Innovation
- Weebit Nano announces A$80.0 million Placement
- Joya Design Takes Neuromorphic Chip from Design to Device with First Innatera-Powered Consumer Audio Product at AWE China