CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution
MOUNTAIN VIEW, Calif., Oct. 19, 2017 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and Cyberon Corporation, a leading embedded speech solution provider, announced today that the companies have partnered to offer an ultra-low power, always-listening voice activation solution for smartphones, consumer and IoT devices. Cyberon have developed an optimized implementation of its CSpotter voice recognition engine for the CEVA-TeakLite family of DSPs. Cyberon will demonstrate CSpotter on CEVA-TeakLite-4 silicon at the upcoming CEVA Technology Symposium in Taiwan on October 27th, 2017. For more information on how to attend, please visit http://events.ceva-dsp.com/symposium-2017-en/registration-form-hsinchu/.
Voice activation and control is rapidly gaining popularity across the electronics industry, where hands-free and eyes-free interaction with smartphones, smart speakers, toys and more is becoming a must-have feature. Cyberons' CSpotter listens to ambient speech to detect and respond to a set of predefined words and/or trigger commands. CSpotter supports 33 languages, based on phoneme acoustic models. CSpotter technology is specifically designed to address low power, always-on use cases and is a valuable addition to the CEVAnet partner ecosystem. The technology offers both optimized speaker independent and dependent voice activation for the CEVA-TeakLite DSPs and is already implemented and available on CEVA-powered merchant silicon.
"The CEVA-TeakLite family of DSPs already power billions of smartphones, consumer electronics and other smart IoT devices, making CEVA an ideal partner for our CSpotter technology," said Tai-Hsuan Ho, founder and CEO of Cyberon. "CSpotter on CEVA's DSPs is a highly compelling offering, with unmatched accuracy and performance in the noisiest environments and at minimal power consumption."
"Cyberon's low footprint voice trigger/word spotter and vast multi-language support is very impressive," said Moshe Sheier, director of strategic marketing at CEVA. "Coupled with the world's lowest power audio/voice DSP family, the joint implementation offers a perfect combination of performance and power efficiency for adding an always-listening voice interface to a wide range of smart devices, including smartphones, toys, wearables, automotive and IoT."
About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, advanced imaging, computer vision and deep learning for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi (802.11 a/b/g/n/ac up to 4x4) and serial storage (SATA and SAS). Visit us at www.ceva-dsp.com
Related Semiconductor IP
- 5G IoT DSP
- 5G RAN DSP
- 32-bit 8-stage superscalar processor that supports RISC-V specification, including GCNP (DSP)
- Compact High-Speed 32-bit CPU Core with DSP
- 16-bit fixed-point general purpose DSP
Related News
- BrainChip and HaiLa Partner to Demonstrate Ultra-Low Power Edge AI Connectivity for IoT Sensor Applications
- CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs
- CEVA Audio Front End Software Solution Becomes Alexa Voice Service (AVS) Qualified
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack