A New Broadcom: The First Cuts
Engineering included in $750M annual savings
Rick Merritt, EETimes
5/28/2015 04:20 PM EDT
SAN JOSE, Calif. –Avago Technologies bid $17 billion in cash and $20 billion in stock for Broadcom, creating the world’s sixth largest chip vendor in what’s being hailed as the semiconductor industry’s biggest proposed merger to date. The combined company promises to slash at least $750 million in annual costs within 18 months mainly from streamlining operations including cuts in engineering staff.
Henry Samueli, Broadcom’s co-founder and chief technologist, will become CTO of the merged company which will retain the Broadcom name. In a conference call with analysts he laid out the philosophy for merging the two company’s engineering teams if the deal closes as anticipated by April 2016.
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related News
- Redesign of NXP Semiconductors Organization - Restructuring targets USD 550 M annual cost savings
- inSilicon Corporation Reports Fourth Quarter and Annual Results
- TransEDA Announces Simulation Edge Suite for Faster Design Verification At 50 Percent Savings
- Virage to base royalties on OEM savings
Latest News
- Perceptia Releases Design Kit for pPLL05 on GlobalFoundries 22FDX Platform
- aiMotive Signs License Agreement with Socionext for aiWare NPU IP to Power Next-Gen ADAS SoC
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 10% Year-on-Year in Q2 2025
- Silvaco to Acquire Mixel, Inc. a Provider of Low-Power, High-Performance Mixed-Signal Connectivity IP Solutions
- Cadence Design Systems Agrees to Plead Guilty and Pay Over $140 Million for Unlawfully Exporting Semiconductor Design Tools to a Restricted PRC Military University