A New Broadcom: The First Cuts
Engineering included in $750M annual savings
5/28/2015 04:20 PM EDT
SAN JOSE, Calif. –Avago Technologies bid $17 billion in cash and $20 billion in stock for Broadcom, creating the world’s sixth largest chip vendor in what’s being hailed as the semiconductor industry’s biggest proposed merger to date. The combined company promises to slash at least $750 million in annual costs within 18 months mainly from streamlining operations including cuts in engineering staff.
Henry Samueli, Broadcom’s co-founder and chief technologist, will become CTO of the merged company which will retain the Broadcom name. In a conference call with analysts he laid out the philosophy for merging the two company’s engineering teams if the deal closes as anticipated by April 2016.
To read the full article, click here
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- Redesign of NXP Semiconductors Organization - Restructuring targets USD 550 M annual cost savings
- inSilicon Corporation Reports Fourth Quarter and Annual Results
- TransEDA Announces Simulation Edge Suite for Faster Design Verification At 50 Percent Savings
- Virage to base royalties on OEM savings
Latest News
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
- QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program