Arteris IP FlexNoC Interconnect Licensed by Samsung's System LSI Business for Digital TV Chips
NoC interconnect enables high bandwidth and low latency on-chip communications while increasing functional safety diagnostic coverage
CAMPBELL, Calif. –April 23, 2019– Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect semiconductor intellectual property, today announced that Samsung’s System LSI Business has renewed multiple Arteris IP FlexNoC Interconnect licenses for use in multiple high-performance digital TV (DTV) processing chips utilizing Samsung’s latest semiconductor technology process nodes.
Samsung first licensed FlexNoC interconnect IP in 2010. Since then, Samsung has used Arteris interconnect IP to enable complex SoC architectures in chips like the Exynos mobile processors and other electronic systems.
“Over many years, FlexNoC interconnect IP has helped us accelerate implementation of our digital TV chip designs on our latest semiconductor process nodes,” said Mr. Jaeyoul Lee, Vice President, at Samsung Electronics. “This core interconnect technology is required to develop complex and highly optimized chips in a predictable, low-risk fashion.”
“We are proud to help Samsung accelerate the deployment of digital TV SoCs designs using their latest technology process nodes,” said K. Charles Janac, President and CEO of Arteris IP. “Samsung’s adoption of Arteris FlexNoC interconnect IP is proof of our technology’s critical role in allowing design teams to create highly optimized chips with lower cost and predictable schedule risk.”
About Arteris IP
Arteris IP provides network-on-chip (NoC) interconnect IP to accelerate system-on-chip (SoC) semiconductor assembly for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as Baidu, Mobileye, Samsung, Huawei / HiSilicon, Toshiba and NXP. Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, the CodaCache standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit www.arteris.com
Related Semiconductor IP
- FlexNoC 5 Interconnect IP
 - High-scalable, high-performance Interconnect fabric IP with cache coherence support
 - Interconnect fabric IP with cache coherence support
 - A2B System Interconnect
 - High speed NoC (Network On-Chip) Interconnect IP
 
Related News
- Arteris IP FlexNoC Interconnect Licensed for Use in SK Telecom SAPEON AI Chips
 - Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
 - Arteris IP FlexNoC Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production
 - Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips
 
Latest News
- Qualitas Semiconductor Expands Global Presence with 4nm UCIe and PCIe Gen 6.0 IP Licensing Agreement in the U.S. AI Market
 - ANAFLASH Advances Embedded FLASH Memory for Next-Generation Smart Edge Devices with Samsung Foundry
 - SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
 - Intel Eyeing AI Catchup in Inference with SambaNova Acquisition
 - ADTechnology Collaborates with Euclyd to Develop Ultra-Efficient AI Chip for Datacenters