CommSolid Unveils Market's First Integration-Ready NarrowBand-IoT Modem IP Solution 2017-02-24 12:33:00 IP Cores & Design
CommSolid and Rohde & Schwarz Collaborate on NarrowBand IoT and its Evolution 2017-02-24 03:54:00 Misc
Sequans Integrates Think Silicon GPU Technology in New LTE for IoT System-on-Chip 2017-02-23 17:05:00 Commercial Deals
Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs 2017-02-23 17:02:00 SoC Architecture & Assembly
Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP 2017-02-23 17:00:00 SoC Architecture & Assembly
Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT 2017-02-23 16:07:00 Commercial Deals
Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity 2017-02-23 15:45:00 Analysis & Insight
Neowine selects Barco Silex public key cryptography IP as most efficient hardware block 2017-02-23 09:52:00 Commercial Deals
CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity 2017-02-23 07:30:00 IP Cores & Design
Oski Technology Launches Formal Verification IP Portfolio for ARM AMBA Interface Protocols 2017-02-22 18:31:00 Verification IP
SST Announces Qualification of Embedded SuperFlash on 110 nm CMOS Process 2017-02-22 14:09:00 IP Cores & Design
Silab Tech wins the "SME of the Year" Award at the Small Enterprise Business Awards 2016. 2017-02-22 12:27:00 Misc
First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP 2017-02-21 16:57:00 IP Cores & Design
Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP 2017-02-21 16:52:00 IP Cores & Design
GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications 2017-02-21 14:18:00 Foundries & Process Nodes
Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology 2017-02-21 13:19:00 SoC Architecture & Assembly