CEVA Celebrates 10 Billion CEVA-powered Devices Shipped by Ringing the Nasdaq Opening Bell
MOUNTAIN VIEW, Calif., Jan. 14, 2019 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, is celebrating a significant milestone of 10 billion CEVA-powered devices shipped, with Gideon Wertheizer, CEO and members of the leadership team ringing the Nasdaq Opening Bell on Monday 14th January. The bell ringing ceremony also coincides with the company's first Investor and Analyst Day, which takes place following the opening bell, at the Nasdaq MarketSite in New York.
"On behalf of the CEVA Board of Directors and leadership team, I am extremely proud of reaching this monumental milestone of having helped our customers ship more than 10 billion devices incorporating CEVA IP," said Gideon Wertheizer, CEO of CEVA. "Having started out as a small business unit spinout from a semiconductor company, to becoming a global leader in technology IP for 5G, AI, computer vision, sound and connectivity, it has truly been a remarkable journey. Each and every one of our employees over the years has contributed to this achievement and we are appreciative of the hard work and dedication they all have put in at CEVA. We are excited to celebrate today by ringing the Nasdaq Opening Bell and look forward to seeing how the next 10 billion CEVA-powered devices will help shape the increasingly smart and connected world."
Of the 10 billion CEVA-powered devices shipped, many have been from the world's leading smartphone, consumer, electronic and IoT brands, including Alibaba, Amazon, Apple, Canon, China Mobile, Dell, DJI, Fujifilm, Google, GoPro, Hikvision, HP, Huawei, JD.com, LG, Logitech, Meizu, Microsoft, Nest, Nikon, Nokia, Panasonic, Reliance Jio, Samsung, Siemens, Sony, TomTom, Toshiba, Xiaomi, Vivo and ZTE.
From the early days of DSP processing in 2G handsets, DVD players, hard disk drives and audio players, CEVA's broad portfolio of technologies have powered some of the most advanced applications in the world. Today applications include: 5G RAN, backhaul and user equipment; computer vision and AI in drones, smartphones, surveillance cameras, automotive image sensors, action and mirrorless cameras; audio, voice and sound for voice assistants, wireless speakers, automotive and consumer electronics, and; Bluetooth, Wi-Fi, NB-IoT and Cat-M connectivity in access points, wearables, smart thermostats and thousands of other devices that make up the Internet of Things. For more information on recent CEVA-powered products, visit our gallery at https://www.ceva-dsp.com/powered-products/.
Nasdaq Livestream Information
The Opening Bell ceremony will take place on January 14, 2019 at the Nasdaq MarketSite in New York City. A live stream of the ceremony will be available from 9:15am–9:30a.m. at: https://new.livestream.com/nasdaq/live or http://www.nasdaq.com/about/marketsitetowervideo.asx.
Investor and Analyst Webcast Information
CEVA's Investor and Analyst event and accompanying presentations will be webcast live from the Nasdaq MarketSite. The presentations are scheduled to begin at 9:45am Eastern time and expected to conclude at approximately 2:30pm Eastern time. A webcast replay will also be available. To view the webcast, please visit https://edge.media-server.com/m6/p/6dwh2gmi.
About CEVA, Inc.
CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and cellular IoT (NB-IoT and Cat-M1) enabled devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to 4x4). Visit us at www.ceva-dsp.com
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