DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
- Controller + PHY + 1
- DDR3
- UMC
- 40nm
- LP
Semiconductor IP cores (Intellectual Property cores) are reusable design blocks used in SoC and ASIC development to accelerate time-to-market and reduce design complexity.
These IP cores span a broad range of technologies, including Analog & Mixed Signal, Compute Acceleration, Graphics & Vision, Interface Connectivity , Memory Interfaces, Security, Wireless, System Peripheral, Embedded Memories, and Foundation Libraries. The catalog covers everything from analog front-ends, data converters, processors, DSPs, AI accelerators, and imaging solutions to high-speed connectivity, memory controllers and PHYs, cryptographic engines, embedded memory macros, standard cell libraries, and wireless communication IP.
This catalog allows you to explore and compare IP cores from leading vendors, based on performance, power, process node compatibility, and application domain.
Whether you are designing for automotive, wireless communication, consumer electronics, or data centers, you can find the right IP solutions for your system requirements.
DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), data block;UMC 40nm LP/RVT LowK Logic Process .
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), command / address block,UMC 40nm LP/RVT LowK Logic Process.
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Logic Process
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
DDR3 Combo PHY Compensation Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Compensation Block for solder bump application; UMC 40nm LP/RVT Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for SIP Application; UMC 28nm HPC/RVT LowK Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Log…
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
DDR1/MDDR PHY Data block ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY Data block ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY CMD/ADDR BLOCK ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY CMD/ADDR BLOCK ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process
Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process
High performance 8-bit micro-controller
High performance 8-bit micro-controller with 256 bytes on-chip Data RAM, three 16-bit timer/counter, and two 16-bit dptr; UMC 0.1…