3DIO IP
Filter
Compare
6
IP
from
1
vendors
(1
-
6)
-
TSMC N3P Source Sync 3DIO PHY
- Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
- It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
- The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
- Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
-
TSMC N3P Source Sync 3DIO Library
- Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
- It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
- The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
- Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
-
TSMC N3P 3DIO Library
- Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
- It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
- The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
- Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
-
TSMC N5 Source Sync 3DIO Library
- Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
- It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
- The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
- Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
-
TSMC N5 3DIO Library
- Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
- It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
- The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
- Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration
-
TSMC N5 Source Sync 3DIO PHY
- Synopsys 3DIO IP Solution is a specialized IO for multi-die integration
- It includes multiple IP offerings for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications
- The optimal area of the 3DIO IP is carefully designed to be within the BUMP, providing significant advantages in implementation and signal routing
- Synopsys 3DIO IP Solution is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration