3DIO IP
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6
IP
from 1 vendors
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6)
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TSMC N3P Source Sync 3DIO PHY
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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TSMC N3P Source Sync 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
-
TSMC N3P 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
-
TSMC N5 Source Sync 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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Synopsys Synthesizable 3DIO IP for Flexible Physical Implementation
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
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3DIO PHY IP for TSMC N5
- Optimized for heterogeneous integration in 3D stacking
- TSMC N5