DDR3/ DDR3L Combo PHY IP - 1600Mbps (Silicon Proven in UMC 40LP)
This DDR PHY IP(Double Data Rate) supports DRAM type DDR3, DDR3L this PHY provides low latency, and enables up to 1600Mbps throug…
- Controller + PHY + 1
- DDR3
- UMC
- 40nm
- LP
- In Production
DDR Interface IP cores provide the controller, PHY, and calibration technologies required to connect SoCs and ASICs to external DRAM memory devices, enabling high-bandwidth and low-latency memory access for compute-intensive applications.
This category includes IP solutions supporting DDR2, DDR3, DDR4, and DDR5 memory standards. Available implementations may include memory controllers, PHYs, controller-PHY subsystems, training engines, initialization logic, timing management, ECC support, and signal integrity optimization features designed for reliable operation across advanced semiconductor process nodes.
DDR3/ DDR3L Combo PHY IP - 1600Mbps (Silicon Proven in UMC 40LP)
This DDR PHY IP(Double Data Rate) supports DRAM type DDR3, DDR3L this PHY provides low latency, and enables up to 1600Mbps throug…
DDR/DDR2 SDRAM Controller MACO Core
The DDR/DDR2 Synchronous Dynamic Random Access Memory (SDRAM) Controller MACO Core is a general-purpose memory controller that in…
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device (16Bit)
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device (16Bit)
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device
DDR2/3 PHY Combo PHY data block (1.0v SP & 2.5V device); UMC 90nm SP/RVT LowK Logic Process
DDR2/3 PHY Combo PHY data block (1.0v SP & 2.5V device); UMC 90nm SP/RVT LowK Logic Process
DDR23 COMBO PHY compensation Block ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY compensation Block ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR2/3 COMBO Compensation block (2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Porcess
DDR2/3 COMBO Compensation block (2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Porcess
DDR23 COMBO PHY CMD/ADDR BLOCK ; UMC 40LP/RVT LowK Logic Process with 2.5V device for 2 layer PCB board usage
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
DDR23 COMBO PHY CMD/ADDR BLOCK ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY CMD/ADDR BLOCK ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR2/3 Combo Command /Address Block (with 2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Process
DDR2/3 Combo Command /Address Block (with 2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Process
DDR2-PHY data block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY data block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY data block with BOAC IO; UMC 90nm SP/RVT Lowk Logic Process
DDR2-PHY data block with BOAC IO; UMC 90nm SP/RVT Lowk Logic Process
DDR2-PHY Command/Address block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY Command/Address block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY command/address block for DRAM chip, BOAC ; UMC 90nm SP/RVT Low-K Logic Process
DDR2-PHY command/address block for DRAM chip, BOAC ; UMC 90nm SP/RVT Low-K Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
Data block of 1:2 DDR2-PHY ; UMC 0.11um HS/AE (AL Advanced Enhancement) Logic Process
Data block of 1:2 DDR2-PHY ; UMC 0.11um HS/AE (AL Enhancement) Logic Process
DDR2/DDR1/MDDR Combo Data Block ; UMC 65nm LP/RVT LowK Logic Process
DDR2/DDR1/MDDR Combo Data Block ; UMC 65nm LP/RVT LowK Logic Process
DDR2/MDDR Combo Data Block ; 0.13um Logic HS/FSG Logic Process
DDR2/MDDR Combo Data Block ; 0.13um Logic HS/FSG Logic Process