Vendor: Cadence Design Systems, Inc. Category: UALink

Simulation VIP for UALink

The Ultra Accelerator Link (UALink) Verification IP (VIP) provides a bus functional model (BFM) with integrated automatic protoco…

Verification IP View all specifications

Overview

The Ultra Accelerator Link (UALink) Verification IP (VIP) provides a complete bus functional model (BFM) with integrated automatic protocol checks for physical layer in addition to Media Independent Interface (MII). Designed for easy integration in testbenches at IP, SoC, and system levels, the VIP helps engineers reduce time to first test, accelerate verification closure, and ensure end-product quality. The VIP for UALink can be used as a standalone PHY verification with jump-start test suite – Integration Test Suite (ITS) provided. The VIP for UALink supports a wide range of verification platforms, all major simulators, and the industry-standard Universal Verification Methodology (UVM). The VIP core is written in native C++ language for excellent performance, with seamless integration with verification languages. Supported specification: UALink 200G Rev1.0 specification

Supported specification: UALink 200G Rev1.0 specification

The following table lists the key features offered in the Cadence VIP for UALink:

Feature Name

Description

Device Type

  • Accelerator Device, PHY DUT

Interface

  • Serial, Media Independent Interface (MII)

Link Rate

  • Supports all UALink Speeds:
    • 200G, 400G, 800G; Base Speed: 200GPL
    • 100G, 200G, 400G; Base Speed: 100GPL

Link Width

  • Configurable link width support x1, x2, x4

PMA Bus Width

  • Configurable PMA bus width: 1,2,4,10,16,20,32,40,48,64,66,80,96,120,128,160,240,320 Bits

Bifurcation

  • Supports multi-port configuration: 4 ports x1 lane, 2 ports x2 lanes, 1 port x4 lanes

Key features

  • Compliance to IEEE 802.3dj physical layer specification
  • Verifies Standalone PHY DUT with x1, x2, x4 native widths and 100G, 200G, 400G, 800G speed
  • 1-way, 2-way, 4-way interleaving supported
  • Comprehensive protocol checks with 130+ built-in checks/assertions
  • Serial and PMA bus widths listed at UALink level and MII between DL and PHY
  • Callbacks access at multiple TX and RX queue points for scoreboarding and data manipulation
  • Static and dynamic setting for configuration variables available

Block Diagram

Benefits

  • Power-Efficient Design: Optimized for UALink
  • Low-Latency: For maximum design performance
  • Proven Solution: Full protocol stack implemented and verified in test chips
  • Long-Reach Capability: Robust 224G 47+dB LR performance with LR/MR/VSR support at reduced power

Files

Note: some files may require an NDA depending on provider policy.

Specifications

Identity

Part Number
Simulation VIP for UALink
Vendor
Cadence Design Systems, Inc.
Type
Verification IP

Provider

Cadence Design Systems, Inc.
HQ: USA
If you want to achieve silicon success, let Cadence help you choose the right IP solution and capture its full value in your SoC design. Cadence® IP solutions offer the combined advantages of a high-quality portfolio, an open platform, a modern IP factory approach to quality, and a strong ecosystem. Now you can tackle IP-to-SoC development in a system context, focus your internal effort on differentiation, and leverage multi-function cores to do more, faster. The Cadence IP Portfolio includes silicon-proven Tensilica® IP cores, analog PHY interfaces, standards-based IP cores, verification IP cores, and other solutions as well as customization services for current and emerging industry standards. The Cadence IP Factory provides you with an automated approach to the customization, delivery, and verification of SoC IP. As a result, you can spend more time on differentiation, with the assurance that you'll meet your performance, power, and area requirements. Choosing Cadence IP enables you to design with confidence because you have more freedom to innovate your SoCs with less risk and faster time to market.

Learn more about UALink IP core

Validating UPLI Protocol Across Topologies with Cadence UALink VIP

The UPLI (UALink Protocol Level Interface) is a logical signaling interface that facilitates communication between devices—specifically between originator devices (which initiate transactions) and completer devices (which respond to them). Each transaction comprises a request and a corresponding response, forming a complete communication cycle. Cadence UALink VIP supports various topologies to verify UPLI layer of DUT.

Powering Scale Up and Scale Out with 224G SerDes for UALink and Ultra Ethernet

At the recent ECOC 2025 conference in Copenhagen, Cadence showcased its key role in enabling the future of AI infrastructure with live silicon demonstrations of several essential IP technologies for emerging 800G and 1.6T networks. Powered by Cadence's 224G SerDes IP, Cadence's Ultra Accelerator Link (UALink 1.0) scale-up and Ultra Ethernet scale-out networking solutions deliver the performance, flexibility, and interoperability needed for next-generation AI factories and hyperscale data centers.

How Ultra Ethernet And UALink Enable High-Performance, Scalable AI Networks

This article delves into the technical aspects of how scaling up and out is becoming a critical need for HPC and AI chip developers, and how new standards such as Ultra Ethernet and Ultra Accelerator Link (UALink) aim to tackle the challenges of high-bandwidth, low-latency connectivity and efficient resource management.

Frequently asked questions about UALink IP cores

What is Simulation VIP for UALink?

Simulation VIP for UALink is a UALink IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this UALink?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this UALink IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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