UALink IP Cores

UALink IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.

These IP cores support accelerator-oriented scale-up and die-to-die connectivity in next-generation AI and data-center fabrics, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse

This catalog allows you to compare UALink IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.

Whether you are designing AI scale-up systems, accelerator fabrics, data-center packages, or high-performance interconnect platforms, you can find the right UALink IP for your application.

 
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Compare 8 UALink IP Cores from 3 vendors

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Semiconductor IP