The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
- TSMC
- 16nm
- FFC
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
UCIe Die-to-Die Chiplet Controller
The UCIe Controller IP is a configurable and customizable UCIe 1.1 compliant die-to-die controller.
UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) for Automotive in TSMC (N5A)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N5)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF4X)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in Samsung (SF5A, SF4X, SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.
Industry , AXI5-Stream Solution for UCIe D2D Stacks The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Strea…
Accelerated confidence in simulation-based verification of RTL designs with Universal Chiplet Interconnect Express (UCIe) interfa…
The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heter…
Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.
Universal Chiplet Interconnect Express (UCIe™) Controller
High-bandwidth, low-power and low-latency standardized die-to-die interconnect The Cadence UCIe™ PHY is a high-bandwidth, low-pow…
Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
The Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications.
TSMC CLN5FF GUCIe LP Die-to-Die PHY
IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.
Universal Chiplet Interconnect Express(UCIe) VIP
The UCIe VIP , a solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of y…
The UCIe IP solution includes D2D Adapter layer which supports streaming/PCIe/CXL/Raw flitformats, supports both standard and mai…