DDR2 PHY Compensation block; UMC 55nm SP/RVT LowK Logic Process
DDR2 PHY Compensation block; UMC 55nm SP/RVT LowK Logic Process
- Controller + PHY + 1
- DDR2
- UMC
- 55nm
- SP
- Silicon Proven
DDR Interface IP cores provide the controller, PHY, and calibration technologies required to connect SoCs and ASICs to external DRAM memory devices, enabling high-bandwidth and low-latency memory access for compute-intensive applications.
This category includes IP solutions supporting DDR2, DDR3, DDR4, and DDR5 memory standards. Available implementations may include memory controllers, PHYs, controller-PHY subsystems, training engines, initialization logic, timing management, ECC support, and signal integrity optimization features designed for reliable operation across advanced semiconductor process nodes.
DDR2 PHY Compensation block; UMC 55nm SP/RVT LowK Logic Process
DDR2 PHY Compensation block; UMC 55nm SP/RVT LowK Logic Process
DDR2 PHY compensation block; UMC 65nm SP/RVT LowK Logic Process
DDR2 PHY compensation block; UMC 65nm SP/RVT LowK Logic Process
Command/address block of 1:2 DDR2-PHY ; 0.11um HS/AE (AL Advanced Enhancement) Logic Process
Command/address block of 1:2 DDR2-PHY ; 0.11um HS/AE (AL Enhancement) Logic Process
DDR2/DDR1/MDDR Combo Command/Address Block ; UMC 65nm LP/RVT LowK Logic Process
DDR2/DDR1/MDDR Combo Command/Address Block ; UMC 65nm LP/RVT LowK Logic Process
DDR2/MDDR Combo Command/Address Block ; UMC 0.13um HS/FSG Logic Process
DDR2/MDDR Combo Command/Address Block ; UMC 0.13um HS/FSG Logic Process
DDR2/MDDR PHY CMD/ADDR BLOCK for DIMM usage; UMC 55nm 1.0V with 2.5V device SP/RVT LowK Logic Process
DDR2/MDDR PHY CMD/ADDR BLOCK for DIMM usage ; UMC 65nm 1.0V with 2.5V Device SP/RVT LowK Logic Process
DDR2/MDDR Combo PHY CMD ADDR block ; UMC 55nm SP/RVT Lowk Process with 2.5V device
DDR2/MDDR Combo PHY CMD ADDR block ; UMC 55nm SP/RVT Lowk Process with 2.5V device
DDR2/MDDR PHY CMD/ADDR BLOCK ; UMC 65nm 1.0V process with 2.5V device SP/RVT Lowk Logic Process
DDR2/MDDR PHY CMD/ADDR BLOCK ; UMC 65nm 1.0V process with 2.5V device SP/RVT Lowk Logic Process
DDR3 RTL Digitalize PHY DATA block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
DDR3 RTL Digitalize PHY DATA block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
DDR3 RTL Digitalize PHY AC block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
DDR3 RTL Digitalize PHY AC block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
DDR3 Combo PHY Compensation Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Compensation Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process