Valens Semiconductor Picks Tensilica's Diamond Standard 108Mini for chip that Ensures High-Quality Home Audio-Video Networking
-- Tensilica, Inc. today announced that Valens Semiconductor, an Israeli start-up, has selected the Diamond Standard 108Mini as the controller for a SOC (system-on-chip) design that will enable high-quality transmission of audio and video in a home networking environment.
“We are designing a chip that will enable high quality transmission of audio and video in a home networking environment,” stated Dror Jerushalmi, CEO of Valens. “We picked the Diamond Standard 108Mini as our central controller based on the high quality Diamond Standard software tool environment, the low-power advantages of the Diamond 108Mini processor compared to conventional alternatives, and because the Diamond 108Mini core had the performance-headroom we needed.”
“We are excited to work with Valens Semiconductor, a highly innovative company, on next-generation consumer electronics,” stated Steve Roddy, Tensilica’s vice president of marketing. “Their project should lower the costs and simplify the installation of home networking, while bringing real consumer value.”
About Valens Semiconductor
Valens Semiconductor Ltd. is a fabless semiconductor company pioneering high definition audio and video transmission technology inside the home. The company is headquartered in Hod Hasharon, Israel.
About Tensilica
Tensilica, Inc. is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors in the market today – including full software tool-chain and modeling support - in both, an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provides semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals. For more information on Tensilica’s patented, benchmark-proven processors, visit www.tensilica.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Aquantia Licenses Tensilica's Diamond Standard 108Mini for Next-Generation 10GE Over Copper Integrated Circuit
- Nethra Licenses Tensilica's Diamond 108Mini Core Processor for Mobile Handset Imaging
- EE Solutions Licenses Diamond Standard 108Mini Processor Core for High Performance, Low Power
- Plato Networks Adopts Tensilica's Diamond Standard 108Mini For Upcoming 10Gigabit PHY Design
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack