EE Solutions Licenses Diamond Standard 108Mini Processor Core for High Performance, Low Power
SANTA CLARA, CA, –October 17, 2006 –Tensilica, Inc. today announced that EE Solutions (EES) of Hsinchu, Taiwan, a leading design service provider with considerable expertise in SOC (system-on-chip) design, has licensed the Diamond Standard 108Mini processor core for a high-performance, low-power application for one of its customers.
"Tensilica’s Diamond Standard 108Mini core perfectly met our needs for a low-cost, low-power, high-performance controller core for a high-volume customer application in the mobile space,” stated Jim Su, chief executive officer of EES. “We evaluated all of the popular 32-bit controller cores on the market, and Tensilica’s Diamond Standard 108Mini gave us the best price,performance and power solution.”
“We are pleased that EES picked our Diamond Standard 108Mini over other cores on the market,” stated Steve Roddy, Tensilica’s vice president of marketing. “The Diamond Standard 108Mini has set a new industry standard for price and performance in demanding applications.”
About EE Solutions
EE Solutions (HsinChu, Taiwan) Inc. is a leading provider of turnkey ASIC and System-on-a-Chip (SoC) design services to integrated circuit and systems companies worldwide. The company is recognized for its engineering background, demonstrated experience in overseas delivery, precision in executing concepts, advanced design and research capabilities, and providing customers with optimal solutions to achieve their business objectives. EE Solutions also offers effective design methodologies and a wide range of advanced intellectual property and professional personnel to help customers step into the ultra-deep-submicron design field. Please visit www.e2-solutions.com.tw for more information.
About Tensilica
Tensilica offers the broadest line of controller, CPU and specialty DSP processors on the market today, in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. Tensilica’s low-power, benchmark proven processors have been designed into high-volume products at industry leaders in the digital consumer, networking and telecommunications markets. All Tensilica processor cores are complete with a matching software development tool environment, portfolio of system simulation models, and hardware implementation tool support. For more information on Tensilica's patented approach to the creation of application-specific building blocks for SOC design, visit www.tensilica.com.
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
Related News
- Andes Technology's N25F RISC-V Processor Enables Superior Performance And Low Power For Phison's X1 Enterprise SSD Controller
- Ubilite Licenses RISC-V Application Processor IP Core from CAST
- Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor
- Aquantia Licenses Tensilica's Diamond Standard 108Mini for Next-Generation 10GE Over Copper Integrated Circuit
Latest News
- Arm Neural Technology Delivers Smarter, Sharper, More Efficient Mobile Graphics for Developers
- Indian Startup Builds Full-Stack Edge AI Chips Using In-House IP
- AIStorm & Tower Semiconductor Introduce Cheetah HS, World’s First Up-to-260K FPS AI-in-Imager Chip for Inspection, Robotics & Sports
- EnSilica Establishes New EU Mixed-Signal Design Centre in Budapest, Hungary
- M31 Technology: Robust Foundry Demand, Operating Margin Expected to Recover in 2026