UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership
BEAVERTON, Ore.-- August 02, 2022 -- Today, Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company announced the incorporation of the UCIe™ (Universal Chiplet Interconnect Express™) Consortium and unveiled two newly-elected Board members Alibaba and NVIDIA. The founding members announced the formation of the industry consortium in March 2022 and remain dedicated to advancing the UCIe specification to establish a chiplet ecosystem and future generations of chiplet technologies.
“The industry response to our announcement of UCIe has been overwhelmingly positive, and we’ve already had more than 60 companies now,” said Dr. Debendra Das Sharma, Chairman, UCIe Consortium. “Our official incorporation is a great milestone as we have an ambitious plan to continue evolving UCIe technology to meet industry requirements and develop a global interoperable chiplet ecosystem.”
UCIe 1.0 Specification – Available to Download
The UCIe 1.0 specification provides a complete standardized die-to-die interconnect with physical layer, protocol stack, software model, and compliance testing. The specification leverages the established PCI Express® (PCI-SIG®) and Compute Express Link™ (CXL™) industry standards. It will enable end users to easily mix and match chiplet components from a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC. The evaluation copy of the UCIe 1.0 specification is available for download here.
Join the UCIe Consortium
The promoter companies include leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers. UCIe Consortium welcomes interested companies and institutions to join the organization as Contributors to help shape future UCIe specifications. For membership information, contact admin@UCIexpress.org.
Resources
- Download the UCIe Specification
- Access the UCIe Membership Agreement
- UCIe Board of Directors
- Statement from UCIe Board Directors
About UCIe™ Consortium
The UCIe Consortium is an industry consortium dedicated to advancing UCIe™ (Universal Chiplet Interconnect Express™) technology, an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. UCIe Consortium is led by key industry leaders Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company. For more information, visit www.UCIexpress.org.
Related Semiconductor IP
- SLVS Transceiver in TSMC 28nm
- 0.9V/2.5V I/O Library in TSMC 55nm
- 1.8V/3.3V Multi-Voltage GPIO in TSMC 28nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- ESD Solutions for Multi-Gigabit SerDes in TSMC 28nm
Related News
- proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification
- VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium
- OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium
Latest News
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications
- GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P
- lowRISC and SCI Semiconductor Release Sunburst Chip Repository for Secure Microcontroller Development
- BrainChip Partners with RTX’s Raytheon for AFRL Radar Contract